Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Work on Advanced Packaging Substrate Technology Development to develop and qualify assembly processes and equipment for next-generation substrate packaging (including EMIB/Co-EMIB). The role combines hands-on process and tool ownership with cross-functional collaboration to improve yield, reliability, and manufacturability.

Experience Level

Entry / Early-career. Candidates with minimal professional experience are acceptable; role is suitable for recent graduates developing into tool/process owners.

Responsibilities

Execute and support process development and equipment qualification to enable advanced substrate packaging technologies.

• Develop and support advanced assembly processes and equipment for substrate packaging technologies.
• Plan and run Design of Experiments (DOEs) to optimize processes and evaluate interactions between process, materials, and equipment.
• Apply statistical analysis and data-driven methods to improve quality, reliability, process capability, and manufacturing efficiency.
• Troubleshoot manufacturing and packaging issues using analytical problem-solving.
• Work with Procurement and Supplier Quality to define material specifications and manage supplier performance.
• Support process documentation, standardization, and preventive/corrective maintenance procedures.
• Collaborate with equipment and material suppliers on tool and material development and qualification.

Requirements

Must-have technical skills and professional behaviors; preferred items listed separately.

• Must-have: Knowledge of manufacturing process control and equipment adjustment.
• Must-have: Hands-on manufacturing aptitude and willingness to work on the factory floor.
• Must-have: Strong problem-solving, analytical thinking, and effective written/verbal communication.
• Nice-to-have: Experience with Design of Experiments (DOE) and Statistical Process Control (SPC).
• Nice-to-have: Experience with statistical or process tools such as JMP or Python.
• Nice-to-have: Experience troubleshooting manufacturing processes and working with cross-functional teams.
• Nice-to-have: Background in materials characterization (e.g., DSC, TGA, FTIR, XPS, SEM) and familiarity with machine learning techniques or relational databases for data analysis.

Education Requirements

One of the following: Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a related engineering discipline (Bachelor's typically requires ~1+ year relevant experience); or a Master's or PhD in one of the listed fields (no prior experience required). Equivalent practical experience in related technical roles is acceptable where indicated by the employer.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.