Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Join Intel's Substrate Packaging Technology Development (SPTD) team in Phoenix to develop and qualify advanced semiconductor packaging processes, materials, and equipment. The role focuses on enabling heterogeneous integration and die disaggregation for Intel's product roadmap and supporting transition to high-volume manufacturing.

The engineer will work on process definitions, equipment configurations, DOE-based characterization, supplier specifications, and sustaining support in a manufacturing environment, collaborating across design, materials, and manufacturing teams.

Experience Level

Entry-level / college graduate (new grad). No specific years of professional experience required; this role is targeted at recent graduates.

Responsibilities

Primary responsibilities include process development, equipment qualification, and cross-functional delivery to meet reliability, yield, and cost targets.

• Develop and qualify advanced packaging processes, materials, and equipment for high-volume manufacturing.
• Design and implement process specifications, prototype workflows, and equipment configurations.
• Plan and execute Design of Experiments (DOE) to define process windows and analyze interactions among materials, chemistry, and equipment.
• Drive continuous process improvements to increase capability, stability, and productivity.
• Collaborate with design, materials, manufacturing, and suppliers to resolve technical issues and establish material specifications.
• Document technical findings and process innovations in reports and technical papers.
• Support standardization and qualification procedures for consistent, scalable manufacturing.
• Provide sustaining support for equipment performance and process health in high-volume manufacturing.

Requirements

Below are core expectations and additional preferred skills. Degree requirements are listed in the Education Requirements section below.

• Must-have (core): Collaborative teamwork, strong written and verbal communication, analytical problem-solving, attention to detail, initiative and ownership, adaptability, and resilience under pressure.
• Must-have (work delivery): Ability to document technical work clearly and to work effectively with cross-functional teams and suppliers in a manufacturing environment.
• Nice-to-have (technical): Experience with Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies (≈6+ months preferred).
• Nice-to-have (process & equipment): Packaging process development, equipment qualification, equipment setup/calibration, and performance evaluation in manufacturing settings.
• Nice-to-have (domain knowledge): Familiarity with semiconductor device fabrication and packaging process flows, process data analysis, variation identification, and implementing process improvements.
• Nice-to-have (project & quality): Experience managing technical projects, and knowledge of quality systems, process documentation, and manufacturing standards.

Education Requirements

Minimum: PhD in a relevant STEM field is required. Preferred fields include PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or a related STEM discipline. The posting indicates experience may be obtained through coursework, projects, research, or internships.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.