Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Work on Intel's Advanced Packaging Technology and Manufacturing team to develop, qualify, and optimize semiconductor packaging equipment and processes. The role focuses on improving product performance, manufacturability, yield, cost, and reliability at production scale.

The engineer will collaborate with cross-functional teams, suppliers, and vendors to define equipment specifications, execute experiments, and drive process and reliability improvements.

Experience Level

Mid-level. Typical experience expectations: 3+ years with a Bachelor's degree, 2+ years with a Master's, or doctoral-level experience as specified in the minimum qualifications.

Responsibilities

Core responsibilities include developing and qualifying packaging equipment and processes, performing data-driven analysis, and supporting scalable manufacturing.

• Develop, qualify, and optimize packaging equipment and processes to meet quality, yield, cost, and reliability targets.
• Apply statistical methods (DOE, SPC) to analyze process performance and drive continuous improvement.
• Design and execute experiments to validate technologies under environmental stress (thermal cycling, humidity, mechanical forces).
• Collaborate with design, manufacturing, and suppliers to ensure scalable, manufacturable solutions.
• Define equipment specifications and work with vendors to meet technical and performance requirements.
• Identify and resolve packaging-related reliability issues using failure analysis and data-driven approaches.
• Lead technical problem-solving efforts and contribute to process innovation initiatives.
• Document technical findings, best practices, and support standardization of qualification and quality processes.

Requirements

Must-have technical skills and experience are listed below; preferred items are noted separately.

• Hands-on experience with Statistical Process Control (SPC) and Design of Experiments (DOE).
• Proficiency with mechanical design software such as SolidWorks or AutoCAD.
• Ability to read and produce mechanical drawings and apply Geometric Dimensioning and Tolerancing (GD&T).
• Experience performing failure analysis and root-cause investigations for packaging/reliability issues.
• Experience defining equipment specs and working with vendors to meet technical requirements.
• Strong analytical, communication, and collaborative skills; ability to work independently and in teams.

Nice-to-have / preferred:

• Proven ability to lead technical innovation and manage complex, time-sensitive projects.
• Experience with high-precision manufacturing methods such as stamping and CNC machining.
• Understanding of semiconductor fabrication processes and packaging technologies.
• Familiarity with supply chain management in manufacturing or materials qualification contexts.
• Previous experience in a semiconductor foundry or related environment.

Education Requirements

Required: Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience; OR Master's degree in those fields with 2+ years of experience; OR PhD in the same fields (experience expectations vary by degree). Equivalent practical experience may be considered where stated by employer policies.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.