Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Process Development Engineer focused on solder ball attach, chip attach, component attach and deflux processes within packaging and technology development. Responsible for pathfinding, developing, qualifying materials and processes on test vehicles and products and transferring them to high-volume manufacturing. This is an on-site role based in Kulim, Malaysia.

Experience Level

Mid-level. Requires approximately 5 years of relevant electronic packaging or process development experience.

Responsibilities

Primary responsibilities include process development, experimental characterization, and manufacturing transfer:

• Develop and optimize die/DRAM attach, component attach, solder ball attach and deflux processes for new products and test vehicles.
• Design and run experiments (DOE); analyze data using SPC and other statistical methods; apply FMEA to identify and mitigate failure modes.
• Pathfind, qualify, and ramp materials and processes; document results and improvements in technical reports/white papers.
• Perform materials and process characterization, failure analysis, and feasibility studies to assess technology performance.
• Collaborate with cross-functional teams to integrate technologies and support transfer to high-volume manufacturing.

Requirements

Must-have and preferred technical skills and experience.

• Must-have: Minimum 5 years' experience in electronic packaging and development, with hands-on experience in chip attach, ball attach or deflux processes.
• Must-have: Strong capabilities in experimental design, statistical data analysis, SPC, FMEA, and problem solving for process improvement.
• Must-have: Excellent written and verbal communication skills and ability to work under tight timelines.
• Nice-to-have: Research & development background in packaging process development.

Education Requirements

BEng, MEng, MSc or PhD in Mechanical, Materials, Chemical, Electrical Engineering, Physics, Mechatronics or a related technical discipline. Research and development experience from MSc/PhD candidates is preferred.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.