Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Work in Advanced Packaging Technology Development to develop and optimize panel-level processes and equipment for Intel's assembly and packaging platforms. The role focuses on process characterization, equipment integration, and improving manufacturability, reliability, yield, cost, and productivity for next-generation packaging technologies.

Experience Level

Mid-level. See Education Requirements for specific degree and years-of-experience guidance.

Responsibilities

Accountable for process and equipment development, characterization, and integration to enable new packaging technologies and transfer them toward production.

• Develop and optimize panel-level processes and related equipment for advanced packaging technologies.
• Characterize process windows using design of experiments (DOE) and analyze interactions among equipment, materials, and processes.
• Define equipment configurations, process specifications, and production workflows for new technologies.
• Drive continuous improvement in process capability, quality, reliability, cost, yield, and automation/productivity.
• Develop and maintain test equipment to simulate field conditions (heat, humidity, thermal cycling, dynamic forces) for silicon and package technologies.
• Collaborate with supplier quality and procurement to ensure material specifications and vendor performance meet standards.
• Lead development of novel techniques, tools, and methods to accelerate technology maturity and identify early risks.
• Document results through technical reports and data analysis; partner with internal and external stakeholders to resolve packaging challenges.

Requirements

Must-have:

• Practical experience with electrochemistry, electrolytic and/or electroless processes.
• Relevant industry experience in process development, characterization, or manufacturing for electronic packaging.
• Ability to analyze process data and apply statistical methods to assess process capability and yield.
• Experience troubleshooting integrated technology issues and collaborating across cross-functional teams.

Nice-to-have:

• Proficiency in design of experiments (DOE) and statistical process control (SPC).
• Familiarity with materials testing/characterization techniques (DSC, TGA, D/TMA, ICPMS, FTIR, SEM).
• Experience developing or configuring equipment for environmental and mechanical testing.
• Experience with process control frameworks, automation, and standard office/analysis software.

Education Requirements

MS degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a closely related field plus 4+ years relevant experience; OR PhD in those fields plus 2+ years relevant experience. Qualifications may be met through a combination of industry experience, internships, coursework, or research.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.