Packaging Equipment Development Group Lead

Job Title

Packaging Equipment Development Group Lead

Role Summary

Lead equipment development for semiconductor packaging within Intel's Assembly Technology Development organization. Oversee first-of-kind equipment introductions, ensure integration into processes and high-volume manufacturing, and deliver equipment solutions that meet product and production requirements.

This role manages a team of engineers, coordinates with manufacturing, automation, suppliers, and process integration, and defines long-term equipment capability roadmaps.

Experience Level

Senior-level engineering manager. See Education Requirements for degree-plus-years guidance (examples: Bachelor's +9 years, Master's +6 years, PhD +4 years).

Responsibilities

Primary duties include leading equipment development, introducing new equipment to production, and managing team performance.

• Lead a team responsible for packaging equipment development and integration.
• Plan and execute first-of-kind equipment introductions and transfers to high-volume manufacturing (HVM).
• Make strategic and tactical decisions for module engineering activities and equipment readiness.
• Collaborate with manufacturing, automation, equipment suppliers, and process integration to resolve technical issues and optimize performance.
• Develop long-term equipment capability strategies and solution roadmaps.
• Mentor engineers, manage performance, and drive accountability to deliver results.

Requirements

Core technical skills and experience required; preferred items listed separately.

• Must-have: Demonstrated experience in equipment development and process integration for semiconductor packaging.
• Must-have: Proficiency with statistical methods, experimental design, and data analysis.
• Must-have: Experience introducing equipment and transferring solutions to high-volume manufacturing and coordinating cross-functional stakeholders.
• Preferred: Semiconductor assembly process technology development experience (example: 5+ years).
• Preferred: People management and mentoring experience (example: 3+ years).
• Preferred: Expertise in dispense, thermal, or plasma equipment development, or similar assembly equipment domains.
• Preferred: Ability to define and execute equipment roadmaps and guide external suppliers to deliver required technologies.

Education Requirements

One of the following is required: Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Electrical Engineering, Chemical Engineering or a related field with 9+ years of relevant experience; OR Master's degree in those fields with 6+ years of relevant experience; OR PhD in those fields with 4+ years of relevant experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.