Packaging Engineering Intern (MS/PhD)

Job Title

Packaging Engineering Intern (MS/PhD)

Role Summary

Work on the design, development, and analysis of semiconductor packaging technologies (wirebond, flip chip, modules, SiPs, and other advanced packages) to support TI analog and embedded processing products. Collaborate with cross-functional teams on materials, mechanical, thermal, and electrical characterization and process development.

This internship provides hands-on R&D experience in semiconductor packaging and characterization methods.

Experience Level

Entry-level internship for current graduate students (MS or PhD).

Responsibilities

Typical responsibilities include:

• Interface with multiple engineering and manufacturing groups to support packaging projects.
• Participate in cross-functional teams to develop internal and external packaging solutions.
• Design, develop, and analyze packaging technologies including wirebond, flip chip, modules, and SiPs.
• Perform material, mechanical, thermal, and electrical characterization and testing.
• Support process development and evaluation (e.g., thin-film deposition, plating, etch, wafer bumping).
• Use inspection and characterization tools such as VI scopes and X-ray inspection and assist in failure analysis.
• Document results, present findings, and contribute to on-time project delivery.

Requirements

Summary of desired skills and attributes. Degree requirements are listed separately under Education Requirements.

• Must-have: Strong written and verbal communication; analytical and problem-solving skills; ability to work effectively in teams; good time management and initiative in a fast-paced environment.
• Nice-to-have: Coursework or research in semiconductor packaging/fabrication; experience with AutoCAD and FEM modeling; fundamentals in heat transfer, thermodynamics, and stress analysis; experience with MEMS/3D integration, CVD/PVD, thin-film deposition, electroplating, plasma etch, wafer bumping, or optical packaging; hands-on use of VI scopes, X-ray inspection, materials characterization, and FA techniques.

Education Requirements

Currently pursuing a Master’s or PhD in Mechanical Engineering, Materials Science, Chemical Engineering, Optical Science, Electrical Engineering, or a related field. The posting also references Bachelor's degree level. Minimum cumulative GPA: 3.0/4.0 or higher.

About the Company

Company: Texas Instruments

Headquarters: Dallas, Texas, USA

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for various markets including industrial, automotive, and personal electronics. The company's innovations aim to make electronics more affordable and reliable, fostering advancements in technology through each generation of semiconductors.