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Packaging Engineering Intern

Texas Instruments
September 04, 2026
Internship
On-site
Dallas, Texas, United States
Process Engineering Jobs, Level - Entry or Early Career

Job Title

Packaging Engineering Intern

Role Summary

Internship role on packaging engineering teams developing and analyzing semiconductor packaging technologies (Wirebond, Flip Chip, modules, SiPs and advanced packages). Work involves material, mechanical, thermal, and electrical characterization and participation in cross-functional teams to support product differentiation for analog and embedded processing products.

Experience Level

Entry-level (Internship). Intended for current students; no prior professional experience required.

Responsibilities

Typical intern assignments and contributions include:

  • Support design, development, and analysis of semiconductor packaging technologies.
  • Participate on cross-functional teams to develop internal and external packaging solutions.
  • Perform material, mechanical, thermal, and electrical characterization and failure analysis.
  • Assist with process, assembly, reliability, and materials evaluations for package integration.
  • Document findings, present results, and collaborate with engineering and manufacturing teams.

Requirements

Clear, concise must-have and preferred qualifications for candidates.

  • Must-have: Eligible to work in the United States for the duration of the internship; Texas Instruments will not sponsor work authorization for this position.
  • Nice-to-have: Semiconductor packaging knowledge (processes, assembly, reliability, materials, characterization, FA).
  • Nice-to-have: Demonstrated analytical and problem-solving skills.
  • Nice-to-have: Strong written and verbal communication and the ability to work effectively in teams.
  • Nice-to-have: Time management, initiative, and ability to deliver on project schedules in a fast-paced environment.

Education Requirements

Currently pursuing a Bachelor’s degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related technical field. Cumulative GPA of 3.0/4.0 or higher. (The job info page also lists a generic "Degree Level: High School Graduate," but the minimum qualifications explicitly require active pursuit of a Bachelor’s degree.)


About the Company

Company: Texas Instruments

Headquarters: Dallas, Texas, USA

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for various markets including industrial, automotive, and personal electronics. The company's innovations aim to make electronics more affordable and reliable, fostering advancements in technology through each generation of semiconductors.

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Date Posted: 2026-09-02