Packaging Engineer - HV GaN module

Job Title

Packaging Engineer - HV GaN module

Role Summary

Engineer responsible for development of high-voltage GaN power packages and modules within the Emerging Packaging Technologies team. Focus on designing, validating, and ramping HV packages for AI infrastructure and industrial applications while collaborating with cross-functional teams and external suppliers.

Experience Level

Mid-level (requires 5+ years of hands-on experience in high-voltage or high-power semiconductor packaging).

Responsibilities

Primary responsibilities include design, validation, qualification, and scale-up of HV packages and modules.

• Design and characterize high-voltage (200–1200 V) packages and power modules for AI infrastructure and industrial markets.
• Translate system requirements and market trends into package design specifications.
• Define packaging solutions across GaN, SiC, IGBT, and isolation technologies and validate designs using CAD, thermomechanical, and electrical parasitic extraction tools.
• Work with material suppliers to qualify mold compounds, die attach materials, and substrates for HV applications.
• Support reliability, qualification activities, and problem solving for HV discrete and power modules.
• Support scale-up from prototype to volume manufacturing and present technical results at reviews or conferences.
• Collaborate with cross-functional teams across sites and with external suppliers.

Requirements

Must-have technical skills and practical experience.

• 5+ years hands-on experience in high-voltage (200–1200 V) or high-power semiconductor packaging across GaN, SiC, or IGBT technologies.
• Hands-on experience with HV package and power module design, materials, and assembly flow integration (molded packages such as TOLT, TOLG, Q-DPAK, DIP, SIP and case modules).
• Familiarity with HV bill of materials including mold compounds, die attach, and DBC substrates.
• Experience with stress, thermal, and electrical parasitic modeling tools.
• Understanding of HV discrete and power module reliability and qualification requirements and ability to support qualification activities and troubleshooting.
• Experience scaling HV packages/modules from prototype to volume manufacturing and presenting technical work internally or at industry conferences.
• Working knowledge of clip attach, flip-chip packaging, and wafer bumping processes.
• Strong communication skills; ability to work effectively with internal teams and external suppliers; proficiency in English and Japanese.

Education Requirements

Minimum qualifications list an MS degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field. Job info also indicates Bachelor's degree level. Degrees in related technical fields are acceptable; the posting does not explicitly state an "equivalent experience" exception.

About the Company

Company: Texas Instruments

Headquarters: Dallas, Texas, USA

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for various markets including industrial, automotive, and personal electronics. The company's innovations aim to make electronics more affordable and reliable, fostering advancements in technology through each generation of semiconductors.