Packaging Engineer

Job Title

Packaging Engineer

Role Summary

Work on design, development and volume scaling of high-voltage (200–3300V) semiconductor packages and high-power modules for industrial, automotive, renewable and telecom markets. Collaborate across product groups, suppliers and manufacturing to deliver robust package solutions and accelerate time-to-market.

Experience Level

Senior — typically requires 8+ years of relevant experience in high-voltage and high-power semiconductor packaging.

Responsibilities

Primary duties include technical leadership of package and module development from concept through high-volume manufacturing.

• Define, design and develop high-voltage packages and high-power modules and scale them to volume production.
• Translate market and system requirements into package/module roadmaps and design specifications.
• Specify and validate solutions across HV technologies (GaN, SiC, IGBT, isolation) using CFD, thermomechanical and electrical parasitic extraction tools.
• Develop process flows and technologies for first-article prototypes and for high-volume manufacturing.
• Define and execute package reliability and qualification plans; summarize failure modes and implement corrective actions.
• Manage material, process and equipment selection; work with suppliers on mold compounds, die attach, substrates and related components.
• Lead and coordinate cross-functional, global teams to accelerate development cycles and ensure product launches.

Requirements

Key technical and professional requirements. Education details are listed below.

• Must have: 8+ years of experience with high-voltage (200–3300V) and high-power (5 kW–300 kW) semiconductor packaging across GaN, SiC, IGBT, Super Junction MOSFET technologies.
• Must have: Hands-on experience with high-voltage package and power module design, materials, equipment and assembly flow integration (molded packages and case modules).
• Must have: Practical experience with stress, thermal and electrical modeling and validation tools (CFD, thermomechanical, parasitic extraction).
• Nice to have: Experience scaling HV packages/modules from concept to high-volume manufacturing; familiarity with clip attach, flip-chip and wafer bumping processes.
• Nice to have: Knowledge of magnetics and high-power-density enterprise power modules, HV bill of materials, and industry/subcon packaging capabilities and roadmaps.
• Nice to have: Proven ability to define and drive reliability and qualification strategies and to present technical work at international conferences.
• Strong communication skills and ability to work with internal and external customers and suppliers.

Education Requirements

Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering or a related engineering field (Master's degree explicitly listed as required in the posting).

About the Company

Company: Texas Instruments

Headquarters: Dallas, Texas, USA

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for various markets including industrial, automotive, and personal electronics. The company's innovations aim to make electronics more affordable and reliable, fostering advancements in technology through each generation of semiconductors.