Packaging Assembly Engineer

Job Title

Packaging Assembly Engineer

Role Summary

Lead development, optimization, and sustaining of advanced flip-chip BGA (FCBGA) assembly processes for SoC packages from pathfinding and NPI through high-volume manufacturing. Work with cross-functional hardware teams and external foundry/OSAT partners to define process flows, BOM, and design rules optimized for performance, reliability, yield, and cost.

This role focuses on technical execution, transfer to volume manufacturing, and cross-site coordination.

Experience Level

Senior — typically requires 5+ years of experience in semiconductor packaging.

Responsibilities

Lead and deliver packaging assembly technology and process development for FCBGA and related package types.

• Define and optimize end-to-end FCBGA assembly process flow (wafer back-end interface, flip-chip attach, underfill, lid/heat spreader attach, ball attach, singulation, inspection).
• Develop and maintain process documentation: specifications, work instructions, control plans, PFMEA, and process flow diagrams.
• Plan and execute DOE and statistical analysis (SPC) to improve yield, quality, and cost; drive closure on findings.
• Lead root-cause analysis and corrective actions for assembly excursions, yield issues, and customer returns with quality, reliability, and FA teams.
• Provide DFM input to substrate and package design teams on pad/bump design, stack-up, warpage control, and assembly design rules.
• Support NPI builds and ramp at OSAT sites: define process windows, buy-off criteria, and transfer to volume manufacturing.
• Drive continuous improvement for cycle time, throughput, equipment uptime, and cost while meeting quality and reliability targets.
• Interface with equipment and materials suppliers to evaluate new tools and materials (underfill, solder, flux, lid attach, etc.).
• Travel internationally as required (approximately 5%).

Requirements

Must-have technical skills and experience.

• 5+ years of experience in the semiconductor packaging field.
• Experience with large FCBGA, MCM, 2.5D and 3D packaging technologies and assembly processes.
• Working knowledge of materials characterization and analysis.
• Familiarity with IC packaging materials, reliability standards, and FA techniques.
• Strong engineering problem-solving skills and fundamentals in engineering physics.
• Ability to work independently and manage projects with minimal supervision; strong cross-functional communication skills.
• Proficiency with package design software such as APD and Virtuoso.
• Experience with memory packaging.

Nice-to-have:

• Program management experience.

Education Requirements

M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or an equivalent technical field preferred; equivalent practical experience may be acceptable.

About the Company

Company: Apple

Headquarters: Cupertino, California, United States

Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.