Package Development, Signal Integrity and Power Integrity Engineer — Senior Staff

Job Title

Package Development, Signal Integrity and Power Integrity Engineer — Senior Staff

Role Summary

Senior engineer responsible for electrical design, modeling, characterization, and development of advanced IC packages with a focus on signal integrity (SI) and power integrity (PI) for high-speed interfaces.

Works within Marvell's central advanced packaging organization to select package technology, drive layout and manufacturability, and coordinate across suppliers, IC designers, and cross-functional teams to meet performance, reliability, and cost targets.

Experience Level

Senior-level. The posting specifies degree-based experience guidance: see Education Requirements for degree and years mapping.

Responsibilities

Primary responsibilities include package electrical development and cross-functional coordination:

• Develop and validate package electrical designs for high-speed interfaces (signal and power integrity).
• Create models and run 2D/3D EM and channel simulations; perform frequency- and time-domain analysis.
• Characterize package performance and drive layout changes to meet SI/PI targets and manufacturability.
• Work with package suppliers to select technologies and ensure compliance with performance, reliability, and cost requirements.
• Collaborate with IC designers and product/marketing teams to define achievable package specifications.
• Contribute to development of new package technologies and support new product introduction through development and production phases.

Requirements

Technical skills and constraints required for the role.

Must-have:

• Strong fundamentals in electromagnetics, transmission lines, and microwave theory.
• Experience using 2-D and 3-D EM simulation tools (e.g., Ansys HFSS, SIwave, Cadence Clarity).
• Frequency-domain and time-domain knowledge of high-speed signaling and channel behavior.
• Ability to automate SI/PI and packaging workflows with scripting (e.g., Python).
• Experience with high-speed electronic packaging for digital and analog ICs and power plane design/analysis (e.g., PowerSI, SIwave).
• Familiarity with circuit simulation tools (Spectre, ADS, HSpice) and EMI/EMC debugging and simulation.
• Familiarity with packaging technologies, materials, substrate design rules, assembly rules, and IC package layout tools (APD, PADS).
• Ability to manage package development across cross-functional teams and communicate technical findings clearly.
• May require eligibility to access export-controlled technology; non-U.S. citizens may be subject to export license review prior to employment.

Nice-to-have:

• Experience with 2.5D/3D package development and CPC/CPO connectors.
• Channel simulation experience using MATLAB, ADS, or similar tools.
• Track record of new product introduction and familiarity with thermal and mechanical analysis of packages.
• Strong presentation, documentation, and cross-team leadership skills.

Education Requirements

Required: Bachelor's degree in Computer Science, Electrical Engineering, or related field with 5–10 years relevant experience, OR a Master’s degree or PhD in Computer Science, Electrical Engineering, or related field with 3–5 years relevant experience. (Degree-and-experience mapping appears in the original posting.)

About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.