Package Design Engineer

Job Title

Package Design Engineer

Role Summary

Design and deliver flip-chip BGA package solutions for ASICs with high-speed SerDes, RF/microwave ADC/DAC, DDR and related high-frequency interfaces. Work within a global R&D team supporting AI, networking, HPC and 5G products to ensure signal integrity, power integrity, manufacturability and thermal reliability of package architectures.

Experience Level

Mid-level (typical 3–7 years). The posting specifies multiple experience bands depending on degree; see Education Requirements for degree-specific years.

Responsibilities

Key responsibilities include:

• Lead ASIC package layout and routing for flip-chip BGA designs.
• Design high-frequency/datarate structures for SerDes, ADC/DAC, DDR and similar interfaces.
• Address impedance matching, crosstalk, signal integrity and power integrity at the package level.
• Evaluate and optimize manufacturability, reliability and thermal performance of package designs.
• Manage multiple projects: schedule, prioritize and track deliverables.
• Collaborate with internal teams across time zones and with external vendor designers.

Requirements

Must-have technical skills and capabilities:

• Proven experience in flip-chip BGA package design and high-speed SerDes signal structures.
• Working knowledge of package-level signal integrity and power integrity principles.
• Ability to work with industry EDA tools for package design; Cadence APD (Allegro Package Designer) is preferred but equivalent tools are acceptable.
• Experience coordinating co-design efforts with vendors and cross-functional teams across multiple time zones.
• Good organizational and task-management skills for handling concurrent package design projects.

Education Requirements

Degree and experience expectations from the posting: B.Eng (EE/EEE) or similar field with 5+ years of flip-chip BGA/package design experience; M.Eng (EE/EEE) or similar field with 3+ years. Preferred: B.Eng with 8+ years or M.Eng with 6+ years in flip-chip-BGA package design including high-speed SerDes. The posting allows "similar field" as an alternative to listed degrees.

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.