Package Design Engineer
ArmJob Title
Package Design Engineer
Role Summary
Join the System-in-Package (SiP) Integration team to define, design, and verify multichip package solutions (2.xD and 3D) that optimize performance for Arm IP ecosystems. Work with internal SoC, IP, signal/power integrity, and systems teams and external technology partners to deliver manufacturable package designs.
Experience Level
Mid-level — typically requires 5 or more years of relevant package design experience.
Responsibilities
Design and validate advanced package solutions and collaborate across functional teams to integrate package constraints into system designs.
- Develop and draw novel System-in-Package (SiP) designs for multichip systems.
- Define package architecture, power delivery structures, and interfaces for advanced packaging.
- Verify package designs for signal and power integrity and manufacturability.
- Provide inputs and constraints to digital P&R teams and interact with SI/PI engineers.
- Coordinate with global teams and external partners across locations (France, US, UK, etc.).
- Work on loosely defined problems and adapt designs as technology requirements evolve.
Requirements
Must-have technical skills and experience.
- 5+ years of package design experience.
- Practical understanding of signal and power integrity principles to optimize designs.
- Proficiency with package drawing tools (Cadence APD/SiP/Allegro or equivalent).
- Strong communication and collaboration skills for cross-functional and global teamwork.
Nice-to-have:
- Experience with large LPDDR and DDR interfaces.
- Experience with 2.xD and 3D package systems.
Education Requirements
Engineering degree or equivalent practical experience.
About the Company
Company: Arm
Headquarters: Cambridge, United Kingdom
ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.
