Package Design Engineer
BroadcomJob Title
Package Design Engineer
Role Summary
Design and deliver flip-chip BGA package layouts for high-performance ASICs used in AI, networking, HPC, and 5G systems. Work within a global R&D team to meet signal, power, thermal, reliability, and manufacturability targets for high-speed SerDes, RF ADC/DAC, DDR and HBM interfaces.
Experience Level
Mid-level. Typical experience expectations range from about 3–8 years depending on degree level and seniority; see Education Requirements for specific degree-and-experience combinations listed in the source.
Responsibilities
Primary tasks and responsibilities:
- Lead package layout and routing for ASIC flip-chip BGA designs, addressing impedance control, crosstalk, signal integrity, power integrity, thermal, reliability, and manufacturability.
- Design critical high-frequency / high-data-rate structures for SerDes, ADC/DAC, DDR, HBM and similar interfaces.
- Coordinate and co-design with internal teams and external vendors across multiple time zones.
- Manage schedules, prioritize tasks, and track progress across multiple simultaneous projects.
- General flip-chip BGA package engineering and support for prototype and production handoff.
Requirements
Must-have technical skills and experience. See Education Requirements for degree details.
- Proven experience in flip-chip BGA package design, including work on high-speed SerDes or equivalent high-speed interfaces.
- Practical knowledge of package-level signal integrity and power integrity and ability to apply SI/PI principles to package layouts.
- Experience with Cadence Allegro Package Designer (APD) preferred; experience with equivalent package design tools accepted.
- Ability to collaborate across a global team and coordinate with external vendors.
- Good organizational and task-management skills to handle multiple package design projects concurrently.
- Nice-to-have: Experience with 2.5D and 3D IC packaging technologies.
Education Requirements
Source specifies technical degrees and associated experience: B.Eng (Electrical Engineering / EEE) or similar with ~5+ years' flip-chip BGA package design experience; M.Eng (EE/EEE) or similar with ~3+ years' experience. Preferred listings note B.Eng with ~8+ years or M.Eng with ~6+ years. Fields cited: Electrical Engineering / EEE or similar technical disciplines. "Similar field" language appears in the source; no explicit mention of certifications was provided.
About the Company
Company: Broadcom
Headquarters: Irvine, California, United States
Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.
