Package Design Engineer
BroadcomJob Title
Package Design Engineer
Role Summary
Design and deliver flip-chip BGA package solutions for high-performance ASICs used in AI, networking, HPC, and 5G. Work with a global R&D team to produce packages that meet signal integrity, power delivery, thermal, manufacturability, and reliability requirements.
Primary focus includes package layout, co-design with internal and vendor teams, and improving design processes and automation.
Experience Level
Mid-level. See Education Requirements for specific degree and years-of-experience guidance.
Responsibilities
Typical responsibilities include design, validation, and project delivery for ASIC packages.
- Lead package design for flip-chip BGA ASICs addressing signal integrity, power integrity, thermal, reliability, and manufacturability.
- Design critical structures for SerDes, ADC/DAC, DDR, HBM and other high-speed or high-power interfaces.
- Perform physical design/layout of package structures using Allegro/APD or equivalent tools.
- Schedule, prioritize, and track work across multiple projects.
- Manage project communication with internal stakeholders and external vendors.
- Contribute to process improvements, automation, and documentation to increase team efficiency.
Requirements
Must-have skills and constraints for the role.
- Experience with flip-chip BGA package design and high-speed interfaces (SerDes, DDR, HBM, ADC/DAC).
- Understanding of electrical engineering fundamentals relevant to package design.
- Practical layout/physical-design skills; experience with Cadence Allegro Package Designer (APD) or an equivalent package-layout tool.
- Working knowledge of package-level signal integrity and power integrity is preferred.
- Familiarity with design-automation scripting (Cadence SKILL or similar) is a plus.
- Ability to collaborate across multiple time zones with internal and vendor teams.
- Self-management, organization, and project-tracking skills.
- This role requires working on-site at the Broadcom office five days per week.
Education Requirements
Degree and equivalent-experience expectations: BSEE (or similar) plus ~2+ years of relevant flip-chip BGA package-design experience, or an MSEE or PhD in a related engineering field. Equivalent practical experience may be considered.
About the Company
Company: Broadcom
Headquarters: Irvine, California, United States
Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.
