Package Design Electrical Engineer

Job Title

Package Design Electrical Engineer

Role Summary

Design and validate IC package electrical solutions within Package Innovation to meet product performance, manufacturability, and cost targets. Work with business-line SoC and PCB teams and package layout engineers to optimize package and system-level electrical performance across applications from DC to >100 GHz.

Experience Level

Mid-level. The posting specifies an advanced degree (see Education Requirements); no explicit years-of-experience guidance provided.

Responsibilities

Primary responsibilities include:

• Define package architectures that satisfy electrical performance, manufacturability, and cost for NPI/NTI projects.
• Perform electromagnetic (EM) modeling and simulation to validate package performance and document results.
• Collaborate with SoC and PCB teams to optimize package/system interfaces and signal/power behavior.
• Provide electrical design rules to Package Design Layout and iterate layout using modeling data to improve IO and power performance.
• Deliver package electrical data or models for system-level simulation and integration.
• Support new technology introductions and cross-functional validation activities.

Requirements

Key qualifications and skills:

• Experience in microelectronics packaging design and EM modeling (required).
• Understanding of electrical design for IO interfaces (e.g., LVDS, DDR, SerDes) (required).
• Strong written/verbal communication, presentation skills, and ability to work in cross-functional teams (required).
• Ability to operate effectively in a fast-paced, global engineering environment (required).
• Nice-to-have: RF design, antenna modeling, and multi-GHz wired/wireless modeling experience.
• Nice-to-have: PCB design experience or experience collaborating with PCB designers.
• Nice-to-have: Knowledge of die-level Back End of Line (BEOL) design.
• Nice-to-have: Familiarity with EM and signal/power integrity tools such as HFSS, Q3D, AWR, CST Microwave Studio, Keysight EMPro, ADS, and Cadence SI/PI tools.

Education Requirements

Master's degree in Electrical Engineering (MSEE) or higher with experience in microelectronics packaging design and EM modeling; related technical fields are acceptable. The original posting specifies "MSEE+ with experiences in microelectronics packaging design and EM modeling or related field required."

About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.