Package Characterization Lab Manager, APTD

Job Title

Package Characterization Lab Manager, APTD

Role Summary

Lead the Package Characterization lab within Advanced Packaging Technology Development (APTD) to deliver package characterization and failure analysis (FA) for leading-edge packaging development. Manage lab operations, drive technical direction, and provide timely, high-quality analysis that informs APTD technical decisions.

The role partners with global engineering labs, subject-matter experts, and external vendors to expand capability, improve efficiency, and prepare the lab for new technologies.

Experience Level

Senior — typically 8+ years of relevant experience in semiconductor package characterization and failure analysis; proven leadership and people-management experience.

Responsibilities

Manage lab operations, technical delivery, and workforce development for package characterization and FA.

• Oversee lab operations to meet KPIs, cycle-time, utilization, safety, and compliance standards.
• Plan and optimize FA equipment, lab space, budgets, and spare parts to maintain high uptime and utilization.
• Coordinate equipment calibration, repairs, and vendor relationships.
• Evaluate and introduce new FA tools and capabilities in partnership with vendors and subject-matter experts.
• Lead EHS, quality, TS, ISO14001, OHSAS, and customer audits with a safety-first approach.
• Provide technical mentorship and drive continuous improvement of characterization methodologies and procedures.
• Collaborate cross-site to standardize methods and ensure readiness for new product designs and technologies.
• Prioritize tasks and resources, and deliver clear, actionable package analysis to support technical and business decisions.
• Build and sustain training, performance metrics, coaching, and career development for engineers and technicians.

Requirements

Must-have technical skills, management experience, and communication capability.

• 8+ years of experience in semiconductor package characterization (physical, thermal, chemical) and failure analysis.
• Knowledge of package FA tools and techniques such as SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.
• Familiarity with semiconductor or advanced packaging manufacturing processes.
• Experience in lab management, shift resource planning, and budgeting.
• Proven technical leadership and people-management capability.
• Strong written and verbal communication skills and a customer-focused mindset.

Education Requirements

Bachelor's degree or higher required; preferred Master's or PhD. Fields: Materials Science, Physics, Chemistry, or related technical disciplines. (The posting does not specify an explicit equivalent-experience exception.)

To request assistance with the application process or for reasonable accommodations, contact hrsupport_sg@micron.com.

Apply: Application page

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.