Package Assembly Process Development Integration Engineer

Job Title

Package Assembly Process Development Integration Engineer

Role Summary

Responsible for process integration, technology transfer, and yield improvement for advanced package assembly programs within the Arizona Package Assembly Development Integration team (APTM).

Lead development and data-collection activities, coordinate cross-functional working groups, and drive process and material solutions to meet cost, schedule, and quality targets. This role requires an on-site presence in Phoenix, AZ.

Experience Level

Mid-level. Typical candidates have approximately 3+ years of relevant industry experience (varies by degree level and background).

Responsibilities

Key responsibilities include:

• Plan and manage development and baseline data collection for test vehicles and products.
• Serve as the key contact for process-level issues within package assembly and lead technical task forces.
• Design and execute DOE plans to support die-package interaction studies, process-flow development, qualification, and yield improvement.
• Manage substrate and material choices to meet cost and schedule targets.
• Use statistical analysis and problem-solving tools to identify root causes and implement corrective actions.
• Coordinate with stakeholders across organizations to deliver integrated, manufacturable solutions.
• Deliver results on schedule while fostering collaborative, inclusive working relationships.
• Travel occasionally as required to support development and manufacturing activities.

Requirements

Must-have and preferred skills/experience:

• Must-have: Experience in semiconductor manufacturing or advanced assembly/packaging processes; hands-on experience with process integration and yield improvement.
• Must-have: Practical experience designing and executing DOE and using statistical process control and data analysis to drive decisions.
• Must-have: Strong communication, cross-functional collaboration, and technical decision-making skills.
• Preferred: Familiarity with characterization techniques such as CSAM, X-ray, XPS, FTIR, SEM, EDX.
• Preferred: Knowledge of package design, die-package interactions, and NPI methodology.
• Preferred: Demonstrated ability to manage materials and substrates to meet cost/schedule constraints.

Education Requirements

Bachelor's degree in Engineering with 3+ years' relevant experience, OR Master's degree with 2+ years' relevant experience, OR PhD in Engineering with 1+ year of relevant experience. Relevant experience can include coursework, projects, internships, or equivalent practical experience in semiconductor manufacturing, assembly, or related technical fields.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.