Package Architect

Job Title

Package Architect

Role Summary

Lead development and qualification of new semiconductor package, process and material solutions with a focus on Power Package platforms. Manage internal and subcontractor development activities and work with cross-functional teams to deliver robust, manufacturable package solutions that meet business and customer requirements.

Experience Level

Senior-level. Years of experience not specified.

Responsibilities

The role combines technical leadership, subcontractor management, and hands-on validation across package development and qualification activities.

• Develop and qualify new package, process and technology solutions for Power Package applications; manage internal and subcontractor development activities.
• Collaborate with internal sites, subcontractors, cross-functional teams, and business groups to align technical solutions with business strategy and customer needs.
• Drive package and process integration assessments and lead risk-assessment activities during development.
• Conduct subcontractor selection and technical assessments (RFQs, capability benchmarking) and maintain subcontractor package portfolios and design rules.
• Plan, review and validate Design of Experiments (DOE), evaluations, mitigation plans, and process freezes with hands-on validation and Gemba activities.
• Lead failure analysis investigations and define corrective/mitigation plans for reliability issues.
• Prepare and present technical reports and papers; submit invention disclosures and patent filings related to package and technology innovations.
• Maintain stakeholder communication and facilitate subcontractor capability-sharing sessions, roadmaps, and technology reviews.

Requirements

Key technical skills, tools and behaviours required to succeed in this role.

• Must-have: Broad knowledge and strong fundamentals in semiconductor assembly processes (Pre-Assembly, Die Attach, Clip Attach, Wire Bond, Molding, Trim & Form, Singulation).
• Must-have: Knowledge of standard semiconductor materials and assembly process flows.
• Must-have: Hands-on experience with engineering and quality methodologies (SPC, DOE, MSA/GRR, 8D, Root Cause Analysis, DFMEA/PFMEA, Control Plan).
• Must-have: Practical experience with statistical analysis tools such as JMP, Statistica, or Minitab.
• Must-have: Strong communication and presentation skills, project planning and coordination, stakeholder management, leadership, and problem-solving abilities.
• Nice-to-have: Final Test experience.
• Nice-to-have: Experience working with AutoCAD.
• Nice-to-have: Prior experience managing or working with subcontractors.

Education Requirements

Not specified.

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.