Package Architect
Subject-matter expert in semiconductor packaging and assembly responsible for package strategy, roadmap and technical leadership for the Low Power Distribution & Protection product group. Owns functionality and performance of package designs and drives innovation and optimization across New Product Introduction (NPI) projects.
Works with cross-functional teams, advises internal and external stakeholders, and contributes patentable design concepts. Role is site-based in Richardson, TX with telecommuting permitted up to three days per week.
Senior β requires substantial, post-baccalaureate experience. The role specifies 8 years of progressive work experience overall and multiple technical experience requirements described below.
Accountable for package design performance, strategy and delivery. Typical responsibilities include:
Minimum technical experience and job conditions required:
Bachelor's degree in Electronics Engineering, Mechanical Design, Physics, Materials, or a related field plus 8 years of progressive post-baccalaureate work experience.
Company: Nexperia
Headquarters: Cabuyao, Philippines
Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.
