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Ocotillo Technology Fabrication Yield Device Integration Engineer

Intel Corporation
July 21, 2026
Full-time
On-site
Phoenix, Arizona, United States
$103,730 - $198,820 USD yearly
Process Engineering Jobs, Level - Mid-Career

Job Title

Ocotillo Technology Fabrication Yield Device Integration Engineer

Role Summary

The Device Integration Engineer drives process and integration work to produce transistors and discrete electronic devices that meet defined performance, quality, reliability, cost, and yield targets. The role partners with Module, Integration, Yield, product and test teams to identify root causes and implement process and device improvements in a manufacturing environment.

Experience Level

Mid-level. The posting expects experienced engineers; see Education Requirements for specific degree and years guidance.

Responsibilities

Primary responsibilities include process integration, yield improvement, and cross-functional problem solving in a high-volume semiconductor fab.

  • Drive factory processes to produce devices that meet strict electrical and physical specifications.
  • Collaborate with Module, Integration, Yield, product, assembly test, and technology development teams to implement process modifications.
  • Control end-of-line (EOL) quality metrics, screen and disposition material, and perform detailed root-cause analyses of discrepant device performance.
  • Use formal problem-solving and statistical methods to improve yield, reduce variability, and contain poorly performing line segments.
  • Design and execute experiments (DOE), analyze results, and lead implementation of process improvements during technology qualification and production ramp.
  • Independently identify improvement opportunities, lead cross-disciplinary technical projects, and communicate technical status and timelines to senior leaders.

Requirements

Must-have technical skills and experience relevant to device integration and yield engineering. Preferred items listed separately.

  • Relevant experience in semiconductor process integration, yield engineering, process development, or technology development.
  • Strong understanding of FEOL and/or BEOL manufacturing processes and failure modes.
  • Proficiency in statistical analysis and quality methods including DOE, SPC, Cp/Cpk, and root-cause methodologies.
  • Experience supporting technology qualification, manufacturing ramp, and high-volume production environments.
  • Proven ability to lead complex technical projects and communicate with cross-functional and senior stakeholders.

Preferred:

  • Deep knowledge of device physics and failure analysis techniques.
  • Basic coding/scripting skills (e.g., JSL, SAS, Python) and experience with data extraction and statistical software (JMP, Minitab).
  • Familiarity with DOE techniques and applying machine learning tools to process and device analysis.

Behavioral: leadership, strong written and verbal communication, organization, and the ability to operate in a fast-paced environment with ambiguous priorities.

Education Requirements

Master of Science in Electrical Engineering, Physics, Material Science, or a related STEM field plus 3+ years of relevant semiconductor industry experience OR a Ph.D. in Electrical Engineering, Physics, Material Science, or a related STEM field. The posting indicates experience may be obtained through a combination of school, work, classes, or research.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-07-17