Ocotillo Failure Analysis Engineer – TEM/AutoTEM Engineer

Job Title

Ocotillo Failure Analysis Engineer – TEM/AutoTEM Engineer

Role Summary

Manufacturing Failure Analysis (FA) engineer responsible for automated and manual TEM analysis to identify root causes of defects, support yield improvement, and accelerate debug cycles for advanced semiconductor technologies.

Work with FA, yield, and process teams in a high-volume lab environment to deliver timely, high-quality TEM data and improve AutoTEM workflows and lab throughput. This role requires on-site presence.

Experience Level

Entry-level / Early-career — suitable for recent graduates and engineers with limited professional experience (typically 0–3 years).

Responsibilities

Primary responsibilities supporting failure analysis and manufacturing yield:

• Operate AutoTEM and manual TEM workflows for defect characterization and yield learning.
• Prepare and analyze TEM samples; coordinate with FIB/PFIB and SEM processes.
• Execute automated TEM job submissions and interpret results for engineering teams.
• Analyze imaging and metrology data to identify defects, process issues, and device structural differences.
• Integrate TEM analysis into FA and yield debug flows through cross-functional collaboration.
• Support high-volume lab operations: prioritization, throughput, and turnaround time management.
• Contribute to development and improvement of AutoTEM flows and best-known methods (BKMs).
• Participate in tool ownership: monitor tool health, troubleshoot, and support continuous improvement.
• Maintain clear documentation of methods, results, and learnings.

Requirements

Minimum and preferred qualifications, separated for clarity.

• Must-have: US citizenship and ability to obtain and maintain a US Government security clearance.
• Must-have: Basic understanding in at least one area: semiconductor manufacturing and device physics, materials characterization, or microscopy theory/experience.
• Must-have: Ability to perform hands-on lab work in a fast-paced, high-throughput environment; strong attention to detail and data quality.
• Must-have: Effective communication and collaboration skills across cross-functional teams.
• Preferred: Familiarity with TEM, SEM, or FIB techniques and failure analysis tools and workflows.
• Preferred: Experience interpreting imaging data, data analysis skills, and exposure to semiconductor processing or advanced-node device structures.
• Preferred: Prior lab or high-volume manufacturing experience and active US Government clearance (Secret or higher).

Education Requirements

Minimum: Bachelor's degree in Engineering or a Physics-related field. Preferred: Master's degree in a relevant field (Master's with no prior professional experience is explicitly noted as a preferred qualification). Ability to obtain and maintain a US Government security clearance is required for employment.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.