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NPI Process Development Engineer

NXP Semiconductors
September 02, 2026
Full-time
On-site
Kuala Lumpur, Malaysia
Process Engineering Jobs, Level - Mid-Career

Job Title

NPI Process Development Engineer

Role Summary

Develop and qualify LQFP and BGA package assembly processes for automotive applications and drive improvements in quality, yield and cost. Produce and maintain process documentation and specifications while coordinating cross-functionally to mitigate risks and meet project objectives.

Lead technical activities, take ownership of key projects, and align scope and direction with management.

Experience Level

Mid-level β€” 3–6 years of semiconductor assembly experience, preferably supporting automotive customers.

Responsibilities

Primary responsibilities include process development, qualification, documentation, and continuous improvement across assembly operations.

  • Develop and qualify LQFP and BGA package assembly processes for automotive applications.
  • Drive yield, quality and cost improvement activities and perform root-cause analysis.
  • Create and maintain process specifications, standard work instructions, OCAPs and QITs.
  • Characterize key processes such as laser/plasma/mechanical dicing, die bond, wire bond, mold, ball attach, marking and singulation.
  • Collaborate with cross-functional teams to resolve technical issues and avoid customer risk.
  • Coordinate with management to define project scope, priorities and timelines.

Requirements

Must-have skills and preferred qualifications.

  • 3–6 years of semiconductor assembly experience supporting automotive customers.
  • Hands-on experience in process characterization for laser dicing, plasma dicing, mechanical saw, die bond, wire bonding, mold, ball attach, marking and singulation.
  • Good SPC, process control, statistical and problem-solving skills.
  • Proficient with Microsoft Office (PowerPoint, Excel macros, Word).
  • Strong interpersonal and leadership skills; self-driven and results oriented.
  • Experience with LQFP, MAPBGA, SiP, FCCSP, FCBGA packaging development is a plus.
  • Project management knowledge is an advantage.

Education Requirements

Not specified.


About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.

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Date Posted: 2026-09-02