NPI Engineer

Job Title

NPI Engineer

Role Summary

Hands-on process engineer responsible for developing and qualifying assembly and packaging processes for silicon photonics products. The role bridges design and high-volume manufacturing and leads technical transfer to contract manufacturers.

Works closely with design, test, and manufacturing partners to deliver robust, scalable, and cost-effective production processes.

Experience Level

Mid-level (5+ years of relevant experience in process engineering or NPI within semiconductor, electronics, or photonics packaging industries).

Responsibilities

Key responsibilities include:

• Develop, characterize, and optimize assembly processes such as precision die bonding, wire bonding, and active/passive optical alignment.
• Design and qualify manufacturing processes and equipment with a path to high-volume manufacturing; define equipment specifications and custom tooling.
• Implement and manage Statistical Process Control (SPC) and apply DOE and Cp/Cpk analysis to monitor and improve process yield.
• Serve as subject-matter expert for Silicon Photonics assembly (fiber attach, thermal management, high-density interconnects).
• Provide Design for Manufacturability (DFM) feedback to product design teams to ensure high-yield production.
• Lead root-cause analysis for yield excursions and implement corrective and preventative actions.
• Create manufacturing documentation (work instructions, control plans, PFMEAs) and manage technical transfer to contract manufacturing partners.
• Specify, source, and qualify automated or semi-automated manufacturing equipment and fixtures.

Requirements

Must-have qualifications and skills:

• 5+ years in process engineering or NPI within semiconductor, electronics, or photonics packaging.
• Direct, hands-on experience developing and sustaining assembly processes: precision die bonding, wire bonding, optical alignment, and wafer-level processing.
• Demonstrated experience with Silicon Photonics device assembly and packaging.
• Proficiency in SPC and DOE to drive yield and manufacturability improvements.
• Experience producing manufacturing documentation and performing technical transfers to CMs.
• Ability to define equipment specifications and drive qualification of production equipment.

Nice-to-have:

• Experience with materials and characterization techniques used in microelectronic and photonic assembly (epoxies, solders, analytical methods).
• Experience ramping processes to high-volume manufacturing and working with offshore contract manufacturers.
• Familiarity with statistical analysis software such as JMP or Minitab.
• Strong problem-solving skills and a data-driven, hands-on approach.

Education Requirements

Bachelor's degree required in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field. Master’s degree or PhD in a relevant discipline preferred.

About the Company

Company: Xscape Photonics

Headquarters: Santa Clara, California, United States

Developer of integrated photonics solutions and instrumentation, specializing in photonic circuits, control systems, and test methodologies for optical communication and sensing applications. Works on device integration, control algorithms, and validation of photonic hardware and firmware.