New College Graduate - HBM Design Architect (MS or PhD)

Job Title

New College Graduate - HBM Design Architect (MS or PhD)

Role Summary

The Heterogeneous Integration Group (HIG) HBM Architecture team evaluates and develops next-generation High-Bandwidth Memory (HBM) and DRAM architectures for AI, HPC, cloud, and networking systems. As an HBM Design Architect (new college graduate), you will analyze architecture and block-level tradeoffs and work with multidisciplinary teams to guide design decisions using analytical models, simulation, silicon data, and data-driven/AI techniques.

Experience Level

Entry-level (new college graduate). Typically 0–1 years of industry experience.

Responsibilities

You will support architecture evaluation, modeling, and cross-team analysis to inform design and technology decisions.

• Analyze HBM and DRAM architectures with analytical models, simulations, silicon data, and AI-assisted techniques to evaluate timing, bandwidth, power, area, thermal behavior, reliability, and complexity.
• Develop and apply modeling, simulation, and data-analysis methodologies to assess alternative architectural approaches and identify design sensitivities.
• Collaborate with architecture, circuit design, layout, packaging, product, and system teams to evaluate implementation feasibility, signal integrity, power delivery, and manufacturability.
• Perform root-cause analysis using simulation and measured data to improve model accuracy and validate assumptions.
• Document and present technical findings, assumptions, risks, and recommended actions to multidisciplinary stakeholders.

Requirements

Concise list of required and preferred technical qualifications.

• Must-have: Strong foundation in at least two areas such as CMOS circuits, digital or mixed-signal design, semiconductor devices, computer architecture, memory systems, thermal sciences, signal integrity, power delivery, or advanced packaging.
• Must-have: Experience developing engineering models, simulations, or analytical methodologies through graduate research, coursework, internships, or lab projects.
• Must-have: Demonstrated ability to evaluate complex technical problems and communicate evidence-based recommendations to multidisciplinary teams.
• Must-have: Strong analytical, problem-solving, written, and verbal communication skills.
• Nice-to-have: Graduate research, internship, thesis, or project experience related to HBM, DRAM, SRAM, memory controllers, high-speed interfaces, semiconductor architecture, or 3D integration.
• Nice-to-have: Experience with circuit/signal simulation tools (HSPICE, Spectre, FineSim, or similar) and familiarity with power/performance/area/timing/thermal tradeoffs.
• Nice-to-have: Experience using data analytics, AI/LLMs, or generative AI to support engineering productivity and design exploration; technical publications, presentations, or patents are a plus.

Education Requirements

Master's or Ph.D. degree in Electrical Engineering, Computer Engineering, or a related technical field required; degree must be completed prior to employment start date.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.