New College Grad - HBM PYE Product Development Failure Analysis Engineer
Micron TechnologyJob Title
New College Grad - HBM PYE Product Development Failure Analysis Engineer
Role Summary
The Product Development Failure Analysis (PDFA) engineer supports introduction of High Bandwidth Memory (HBM) products by identifying and resolving component- and product-level failures that affect yield, reliability, and performance.
This role works on electrical and physical failure analysis, statistical and AI-enabled data analysis, and cross-functional problem resolution with Product, Process, Quality, and Test teams to accelerate production ramp.
Experience Level
Entry-level / New college graduate. Suitable for candidates with recent bachelor’s completion or equivalent practical experience; typically 0–2 years of relevant experience.
Responsibilities
Primary responsibilities include failure analysis, data-driven root cause investigation, and cross-functional collaboration to support product qualification and ramp.
- Perform electrical, physical, and statistical failure analysis to identify component failure mechanisms.
- Analyze characterization and manufacturing data to determine root causes of fabrication, assembly, and test failures.
- Collaborate with Product, Process, Quality, and Test Engineering to define and implement corrective actions that improve yield and reliability.
- Use AI-enabled tools and statistical methods to evaluate large datasets and identify trends.
- Document and communicate findings, corrective actions, and risk assessments to multi-functional partners.
Requirements
Must-have technical skills and abilities needed on day one; preferred skills that improve effectiveness are listed separately.
- Experience or coursework in semiconductor device physics, semiconductor manufacturing processes, or VLSI design.
- Demonstrated knowledge of statistical analysis techniques and data-driven problem solving.
- Proficiency with Python or similar scripting/programming languages for data analysis.
- Ability to analyze complex technical data and present clear findings to engineering teams.
- Strong collaboration skills for working with cross-functional engineering groups.
- Nice-to-have: experience with AI-assisted analytical tools, failure analysis or yield enhancement, and familiarity with advanced memory technologies such as HBM.
Education Requirements
Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related technical field is required or equivalent practical experience. A Master’s degree in those fields is preferred. The posting explicitly allows equivalent experience in lieu of degree.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
