MTS - Thermal Simulation Engineer

Job Title

MTS - Thermal Simulation Engineer

Role Summary

Lead thermal and thermo-mechanical modeling efforts within the Heterogeneous Integration Group to support High Bandwidth Memory (HBM) packaging and system integration. Define simulation strategy, develop physics-based models, correlate to silicon measurements, and influence product, package, material, and process decisions across teams.

Experience Level

Senior-level role. Requires advanced domain experience and demonstrated technical leadership in thermal/multiphysics simulation (see Education Requirements for specific years-of-experience guidance).

Responsibilities

Deliver validated thermal and thermo-mechanical simulation capabilities that guide design and integration of advanced memory packages.

• Lead development of high-fidelity thermal and thermo-mechanical models for HBM packages, including die, interconnects, bonding interfaces, and system-level integration.
• Define and implement multiphysics simulation strategies (thermal, structural, coupled analyses) to evaluate performance and identify risks.
• Analyze thermal transport, heat flux distribution, hotspot behavior, stress, and warpage in stacked memory architectures.
• Lead simulation-to-silicon correlation with characterization and test teams; establish validation criteria and close gaps between prediction and measurement.
• Assess material properties, layout effects, package architecture, and manufacturing variation to identify drivers of thermal resistance and hotspots.
• Translate simulation results into thermally-aware product requirements and design direction; influence cross-functional teams.
• Advance modeling methodologies, automation, and scalable simulation frameworks; mentor engineers and establish modeling guidelines.
• Evaluate and adopt AI-enabled tools to improve engineering workflows, productivity, and quality.

Requirements

Must-have technical skills and proven industry experience required to perform the role.

• Extensive industry experience in thermal simulation or multiphysics modeling for semiconductor devices, advanced packaging, or closely related technologies.
• Strong foundation in heat transfer, thermodynamics, and solid mechanics.
• Hands-on experience with multiphysics simulation tools such as Ansys, Abaqus, Fluent, Star-CCM+, or FloTHERM.
• Demonstrated expertise in finite element modeling (FEM), coupled thermal-structural simulations, and model calibration.
• Experience with simulation-to-silicon correlation, model validation, and technical problem solving for complex systems.
• Ability to assess material characterization and effective thermal property extraction across layered or heterogeneous systems.
• Scripting or data analysis skills (Python, MATLAB, JMP) to automate simulations and analyze results.
• Proven leadership in defining simulation strategy, mentoring engineers, and influencing cross-functional decisions.

Nice-to-have:

• Understanding of HBM, 2.5D/3D integration, TSVs, hybrid bonding, and interposers.
• Familiarity with experimental validation techniques and simulation-to-silicon calibration workflows.
• Exposure to CFD or flow-based simulation for cooling and package-level heat transfer.

Education Requirements

Minimum qualifications: PhD plus 5 years of industry experience, or Master’s degree plus 10 years of industry experience, in Mechanical Engineering, Materials Science, Physics, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.