MTS Process Integration Engineer - APTD Die-Level Technology

Job Title

MTS Process Integration Engineer - APTD Die-Level Technology

Role Summary

Lead development and integration of advanced packaging architectures (2.5D, 3D stacking, HBM, hybrid bonding) and drive their transfer into manufacturing. Work cross-functionally with design, equipment, reliability, test, and manufacturing teams to improve process performance, yield, and reliability for advanced memory and packaging solutions.

Experience Level

Senior - typically requires 8+ years of relevant industry experience in advanced packaging technology development.

Responsibilities

Contribute to process development, qualification, and manufacturing readiness for advanced package architectures.

• Develop and optimize 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnect processes.
• Design and execute experiments to qualify materials, process flows, and design rules for new package architectures.
• Analyze yield, performance, and defect data using SPC and advanced analytics to identify improvements.
• Drive technology transfer: process qualification, design rules, material selection, and manufacturing readiness.
• Predict and mitigate wafer/die warpage via modeling, cure-shrinkage controls, and material/process levers; validate with inline metrology.
• Collaborate with cross-functional teams (design, process, equipment, reliability, test, manufacturing) to deliver production-ready solutions.

Requirements

Technical must-haves and preferred skills for the role. Degree information is summarized separately under Education Requirements.

Must-have:

• 8+ years of experience in advanced packaging technology development, including 2.5D, 3D stacking, and HBM integration.
• Hands-on experience with TSVs, advanced interconnects, die stacking, underfill, molding, bonding, and package integration processes.
• Experience with hybrid bonding integration and reliability for wafer-to-wafer or chip-to-wafer processes.
• Experience with HBM and logic integration, including thermal optimization and reliability considerations.
• Experience supporting cross-functional engineering programs in a fast-paced development environment.
• Skills in SPC, yield/defect analysis, and using data analytics to drive process improvements.
• Demonstrated ability to drive technology transfer and achieve manufacturing readiness.

Nice-to-have:

• Experience with thermocompression bonding, microbump formation, or interposer-based packaging technologies.
• Experience applying automation or AI-enabled workflows to engineering or data-analysis tasks.
• Track record of technical publications, patents, or detailed engineering documentation.

Education Requirements

Minimum: Bachelor's degree in Materials Engineering, Chemical Engineering, or a related technical field. Preferred: Master's degree or PhD in Materials Engineering, Chemical Engineering, or a related field. (Degree fields and preferences were specified in the source.)

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.