MTS - Optical Interconnect Design Architect

Job Title

MTS - Optical Interconnect Design Architect

Role Summary

The Optical Interconnect Design Architect will define and drive next-generation optical connectivity solutions for memory, AI accelerators, and high-performance computing platforms. The role leads architecture development, feasibility analysis, proof-of-concept activities, and cross-disciplinary collaboration with internal and external partners.

Experience Level

Senior-level. Typical experience expectations: PhD with 5+ years in industry, or Master’s with 8+ years; hiring level may scale with qualifications.

Responsibilities

Lead development of optical interconnect architectures and validate technology approaches across device, integration, and system levels.

• Drive architecture exploration and technology pathfinding from high-speed electrical I/O to optical interfaces for AI, HBM, and chiplet systems.
• Define optical I/O architectures incorporating PICs, modulators, detectors, waveguides, packaging, fiber interfaces, and silicon photonics integration.
• Perform tradeoff studies evaluating bandwidth density, latency, power, thermal behavior, reliability, and cost.
• Assess emerging technologies such as optical interposers, co‑packaged optics (CPO), and near‑package optics (NPO).
• Lead proof‑of‑concept demonstrations and technology pathfinding for HBM and die‑to‑die optical interconnect solutions.
• Engage with ecosystem partners and internal teams to align technology roadmaps and manufacturability considerations.

Requirements

Key technical capabilities and experience required.

• Proven experience in optical interconnect architecture, silicon photonics, high‑speed I/O systems, or optical communication systems.
• Strong knowledge of optical communication fundamentals, including WDM/DWDM, optical link budgeting, and photonic integrated circuit concepts.
• Experience performing architecture‑level tradeoff analyses across performance, power, thermal, cost, and scalability metrics.
• Practical use of AI‑assisted analysis for architectural evaluation and technology benchmarking.
• Working knowledge of advanced semiconductor packaging: chiplets, hybrid bonding, 2.5D/3D integration, and heterogeneous integration.
• Ability to lead technical initiatives across multiple engineering disciplines and drive cross‑functional programs.

Education Requirements

PhD in Electrical Engineering, Optics, Photonics, Physics, Computer Engineering, or a related technical discipline with 5+ years of industry experience; or Master’s degree in a related technical field with 8+ years of relevant industry experience. (Related technical disciplines and equivalent industry experience noted in the source.)

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.