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MTS - HIG HBM Architecture

Micron Technology
October 20, 2026
Full-time
On-site
Richardson, Texas, United States
ASIC Design Jobs, Level - Senior

Job Title

MTS - HIG HBM Architecture

Role Summary

Engineer focused on architecture, modeling, and analysis for High Bandwidth Memory (HBM) IO and TSV IO. Work includes electrical modeling, signal integrity (SI) and power integrity (PI) analysis, design optimization, and driving simulation-to-silicon correlation across HBM product generations.

Experience Level

Senior-level. The posting requests 10+ years of relevant engineering or design engineering experience.

Responsibilities

Key responsibilities include architecture, modeling, verification, and cross-functional improvement of high-speed IO for HBM products.

  • Define IO architecture, TSV IO performance targets, and design quality requirements for HBM products.
  • Develop IO and TSV modeling methodologies to support architecture tradeoffs, SI/PI evaluation, and design optimization.
  • Perform electrical modeling and SI/PI analysis for high-speed IO.
  • Drive simulation-to-silicon correlation and post-silicon learning to improve design quality across generations.
  • Define and standardize IO design quality processes from architecture through silicon delivery.
  • Leverage AI-assisted analytics to accelerate root-cause identification from complex silicon data.
  • Collaborate with cross-functional teams on design execution and methodology development.

Requirements

Must-have:

  • Hands-on IO circuit design background covering both analog and digital design and simulation.
  • Experience with circuit verification and optimization, including layout verification and parasitic extraction.
  • Good understanding of device characteristics and hands-on design experience.
  • Familiarity with one or more high-speed interfaces (HBM, DDR, UCIe, PCIe, MIPI).
  • Strong problem-solving, documentation, and communication skills.

Nice-to-have:

  • Prior circuit debug experience through Product Engineering or equivalent.
  • Knowledge of advanced packaging environments (CoWoS, HBM stack, D2D).
  • Experience applying AI-driven or data-driven analysis to silicon debug and quality improvement.

Education Requirements

MS or PhD in Electrical Engineering is required.


About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

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Date Posted: 2026-10-14