MTS - HBM Thermal Integration Engineer

Job Title

MTS - HBM Thermal Integration Engineer

Role Summary

Join the Heterogeneous Integration Group within Technology and Products to optimize thermal performance for next-generation High Bandwidth Memory (HBM) products. The role spans thermal simulation, silicon characterization, process and package integration, manufacturing, test engineering, and product integration.

Experience Level

Mid-level; typically expects multiple years of relevant industry experience (guidance: 5+ years of applied experience in semiconductor product development or related fields).

Responsibilities

Accountable for driving thermal performance improvements across HBM products through cross-functional technical leadership and data-driven investigations.

• Lead thermal performance optimization across design, process, packaging, assembly, and test.
• Develop and execute thermal learning plans, characterization strategies, and DOE to accelerate understanding.
• Analyze silicon characterization, inline metrology, manufacturing, and test data to identify thermal behavior drivers and variation sources.
• Partner with thermal simulation teams to improve correlation between models and measured silicon performance.
• Collaborate with wafer fab, package development, assembly, product engineering, and reliability teams to resolve thermal issues.
• Identify opportunities to reduce thermal resistance, improve consistency, and enhance product performance.
• Drive cross-functional technical investigations and influence engineering decisions using structured problem solving and data analysis.

Requirements

Must-have technical skills and experience required to perform the role.

• Hands-on experience in semiconductor product development within memory, logic, or advanced packaging technologies (process integration, package integration, product engineering, or yield engineering).
• Working knowledge of thermal simulation methodologies and multiphysics modeling; ability to interpret results and apply insights to silicon, package, and technology optimization.
• Experience designing, executing, and analyzing structured experiments and DOE-based investigations.
• Proven ability to analyze large datasets, inline metrology, characterization, manufacturing, and test data to identify performance drivers and variation.
• Experience using data-driven approaches and structured problem solving to influence engineering decisions.
• Familiarity with AI-enabled tools or workflows to analyze data, automate routine tasks, and improve decision-making.

Nice-to-have:

• Knowledge of HBM, 2.5D/3D integration, TSVs, hybrid bonding, interposers, and heterogeneous integration.
• Experience with thermal characterization and silicon validation techniques.
• Experience with statistical analysis of inline metrology, manufacturing, assembly, and test datasets.
• Familiarity with thermal simulation tools such as Ansys, Abaqus, Icepak, FloTHERM, Star-CCM+, or equivalent.
• Experience with Python, JMP, MATLAB, SQL, or similar data analysis environments.
• Experience leading cross-functional technology development initiatives in the semiconductor industry.

Education Requirements

Minimum qualification options specified: PhD plus 5+ years of industry experience, or Master’s degree plus 10+ years of industry experience, in Mechanical Engineering, Materials Science, Physics, Semiconductor Engineering, Electrical Engineering, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.