MTS - Advanced Packaging 2.5D and Deep Trench Integration Engineer

Job Title

MTS - Advanced Packaging 2.5D and Deep Trench Integration Engineer

Role Summary

Join the Singapore CMOS product team to lead process integration activities for 2.5D solutions and deep trench (DT) technologies from early development through qualification and manufacturing readiness. The role coordinates module interfaces, executes experiments, analyses electrical and physical data, resolves integration issues, and supports yield, reliability, and manufacturability improvements.

Experience Level

Mid-level. Typical experience expectations depend on degree: B.S. with ~5 years, M.S. with ~3 years, or Ph.D. with relevant research/industry experience.

Responsibilities

Accountable for planning, executing and documenting integration activities to deliver 2.5D and deep trench technology milestones.

• Translate product and technology requirements into integration plans, experiments, and technical deliverables.
• Integrate deep trench modules (etch, dielectric/electrode materials, fill, planarisation, thermal processing, isolation, contact formation, electrical characterisation).
• Support end-to-end 2.5D integration including interposers, TSVs, redistribution layers, wafer thinning, bonding, assembly flows and package interfaces.
• Design and execute test structures, process splits and DOEs to establish process windows and retire technical risk.
• Analyze inline, physical, electrical, defectivity, yield and reliability data; identify trends and failure mechanisms; recommend corrective actions.
• Work cross-functionally with module, device, design, reliability, test, manufacturing and equipment teams to resolve integration issues and improve manufacturability.
• Produce and maintain integration documentation, experiment plans, technical reports, risk assessments and milestone status updates.
• Present technical findings, trade-offs and risks to project teams, management and external partners as required.
• Perform duties in a safe manner and support EHSS programs; on-site presence in Singapore is required; travel up to ~15% may be needed.

Requirements

Core technical skills and practical experience required for immediate contribution to process integration and development programmes.

• Must-have: Practical semiconductor process integration or device integration experience, including advanced packaging or technology development with hands-on work on deep trench and/or 2.5D technologies.
• Working knowledge of deep trench etch, dielectric formation, trench/electrode fill, planarisation, thermal processing and electrical characterisation.
• Familiarity with silicon interposers, TSVs, redistribution layers, wafer thinning, bonding and package assembly flows.
• Experience designing and executing experiments, statistical analysis, root-cause troubleshooting and implementing corrective actions.
• Ability to interpret inline, electrical and physical data; identify failure mechanisms and recommend mitigations.
• Proven ability to work effectively across cross-functional engineering and manufacturing teams with limited supervision.
• Strong written and verbal communication skills in English and ability to work across cultures and time zones.
• Currently based in Singapore or willing to relocate and work on site.

Nice-to-have:

• Experience with metrology, failure analysis, process control, qualification and manufacturing hand-off.
• Knowledge of electrical, thermal or mechanical considerations for 2.5D/interposer flows and high-aspect-ratio silicon structures.
• Experience within Singapore's semiconductor ecosystem (fab, foundry, OSAT, equipment/materials supplier, university or research institute).

Education Requirements

Bachelor's degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics or a related technical field. Experience-based alternatives specified in the posting: B.S. with ~5 years relevant experience, M.S. with ~3 years relevant experience, or Ph.D. with relevant research or industry experience. (Degrees from a recognised institution.)

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.