Mold Process Development Engineer

Job Title

Mold Process Development Engineer

Role Summary

Responsible for developing, characterizing, and industrializing advanced molding technologies for semiconductor packages. Works with cross-functional and global teams to enable new package platforms, improve process robustness, and ensure manufacturability, reliability, and cost-effectiveness.

Provides technical leadership to deliver reliable, manufacturable, and cost-effective package solutions that meet customer and business requirements.

Experience Level

Entry-level; typically 1–2 years of manufacturing experience, preferably within the semiconductor industry.

Responsibilities

Primary duties include process development, technical leadership, and cross-functional support for molding and assembly package solutions.

• Develop and characterize new molding process technologies and platforms.
• Ensure technical communication and information flow within project teams; guide technical discussions on molding topics.
• Conduct competitor benchmarking and technology studies to inform the package roadmap.
• Provide technical input for assembly process and equipment solutions for assigned new products or platforms.
• Identify process integration risks and define risk mitigation plans.
• Deliver development-to-production solutions to establish robust package manufacturability and reliability.
• Provide technical support on molding to internal and external customers.
• Drive resolution of process challenges with cross-site members and demonstrate subject-matter leadership.

Requirements

Must-have technical skills and experience; preferred items listed where applicable.

• 1–2 years' experience in a manufacturing environment, preferably in semiconductor assembly.
• Hands-on experience with molding backend assembly processes.
• Familiarity with wire-bonded and clip-bonded package technologies (preferred).
• Experience with process development methodologies: DOE, FMEA, and statistical analysis techniques.
• Proficient in statistical analysis and quality improvement tools (Minitab or equivalent) and SPC; knowledge of Six Sigma principles.
• Strong analytical, troubleshooting, and structured problem-solving skills.
• Ability to identify process risks and develop effective mitigation strategies.
• Excellent written and verbal communication in English; strong interpersonal, collaboration, and stakeholder-management skills.

Education Requirements

Bachelor's degree in Engineering or a related technical discipline is required. No specific additional fields or certifications were mandated; familiarity with Six Sigma principles and statistical software was noted.

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.