Module Product Engineer

Job Title

Module Product Engineer

Role Summary

Own technical readiness, manufacturability, and lifecycle performance of advanced power modules from new product introduction (NPI) through high-volume production and sustaining. The role coordinates design, test, quality, assembly, and manufacturing to meet performance, quality, cost, and schedule targets at scale.

Experience Level

Senior — typically requires 8+ years of experience in semiconductor product engineering, manufacturing engineering, or test engineering, with demonstrated ownership from NPI through high-volume production.

Responsibilities

Accountable for end-to-end product execution and production readiness for advanced power modules.

• Lead product engineering execution from NPI to high-volume production and sustaining.
• Drive manufacturability and robust assembly processes across OSAT and internal sites.
• Establish and enforce assembly workmanship standards (IPC-A-610) and process controls.
• Coordinate cross-functional alignment among Design, Test, Quality, and Manufacturing.
• Lead resolution of assembly-related excursions (die attach, clip attach, solder integrity, module-level defects).
• Lead product bring-up, characterization, and silicon readiness with Design/Test/Applications.
• Define and maintain product specifications, limits, and guard-bands based on silicon behavior and manufacturing capability.
• Lead yield analysis, parametric trend monitoring, and root-cause investigations.
• Drive cost, yield, and cycle-time improvements using data-driven analysis.
• Own manufacturing release, qualification execution, and product change management.
• Serve as technical escalation owner for production issues, customer returns, and corrective actions.
• Support critical customer engagements on product, quality, and manufacturing topics as needed.
• Travel: approximately 10%.

Requirements

Must-have skills, constraints, and experience for effective performance in the role.

• Must be currently authorized to work in the United States; Renesas will not sponsor work visas for this position.
• Proven ownership of product engineering from NPI through high-volume production.
• Technical depth in semiconductor power products and advanced power module manufacturing.
• Experience with assembly processes and manufacturing transfers to OSAT/internal fabs.
• Strong data analysis skills; ability to interpret statistical results and drive decisions.
• Working knowledge of new product development, qualification, and high-volume manufacturing transfer.
• Strong written and verbal communication skills for customers and cross-functional teams.
• Proven ability to lead complex technical decisions, escalations, and cross-organizational execution.

Education Requirements

Bachelor's degree required in Electrical Engineering, Computer Engineering, or a related field. Master’s degree in a relevant engineering discipline preferred. Mechanical Engineering is preferred for roles focused on module packaging, thermomechanical behavior, and assembly optimization.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.