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Module Development Engineer (Ph.D.) - Intel Foundry

Intel Corporation
October 26, 2026
Full-time
On-site
Hillsboro, Oregon, United States
$133,800 - $188,890 USD yearly
Process Engineering Jobs, Level - Entry or Early Career

Job Title

Module Development Engineer (Ph.D.) - Intel Foundry

Role Summary

Work within Intel Logic Technology Development (LTD) to develop, optimize, characterize, and transfer leading-edge semiconductor process modules into high-volume manufacturing. The role focuses on process and hardware engineering across patterning, thin films, metrology, integration, and yield.

Experience Level

Entry-level / Early career. The posting expects roughly 0–3 years of relevant experience; specifically, at least 6+ months of hands-on semiconductor fabrication or process development experience is required.

Responsibilities

Primary duties include development, control, and transfer of semiconductor process modules and collaboration with cross-functional teams and vendors.

  • Design, execute, and optimize experimental runs to advance process flows, equipment hardware, and material capabilities.
  • Apply statistical modeling, Design of Experiments (DOE), and control systems (SPC, APC, Run-to-Run) to reduce variability and improve yield.
  • Partner with tool and material suppliers and internal integration teams to co-develop equipment and process methodologies.
  • Troubleshoot and resolve root causes for equipment, process, and yield excursions during HVM technology transfer.
  • Document experimental results, operating procedures, and technical recommendations in reports and presentations.

Requirements

Must-have technical experience and demonstrated hands-on work relevant to semiconductor process development.

  • At least 6+ months hands-on experience with semiconductor fabrication, process development, device research, materials research, or related semiconductor technology.
  • Practical experience with one or more process areas: lithography/overlay, epitaxy (EPI), wet etch, dry/plasma etch, thin-film deposition (ALD/CVD/PVD), diffusion, ion implantation, CMP/planarization, metals/metallization, dielectrics, or metrology.
  • Familiarity with FEOL/BEOL process integration, defect reduction, yield analysis, and electrical characterization.
  • Experience using statistical methodologies and engineering software/scripting for data analysis and automation (examples: DOE, SPC; Python, MATLAB, JMP, C#).
  • Ability to work in cleanroom or semiconductor research lab environments and operate/interpret results from analytical instrumentation (examples: ALD, CVD, plasma etch, CD-SEM, TEM, AFM, ellipsometry).

Nice-to-have:

  • Research or academic specialization in transistor architecture, advanced materials, or process integration.
  • Record of technical dissemination such as dissertations, peer-reviewed publications, conference presentations, patents, or white papers.

Education Requirements

Ph.D. in Electrical Engineering, Chemical Engineering, Materials Science & Engineering, Physics, Mechanical Engineering, Chemistry, or a related STEM field (Ph.D. expected to be completed prior to start date). Relevant experience can be demonstrated via academic coursework, laboratory research, thesis work, internships, postdoctoral research, or publications.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-10-23