Module Development Engineer

Job Title

Module Development Engineer

Role Summary

Design and develop advanced semiconductor manufacturing processes and enabling technologies to support device production, yield, and technology roadmaps. Collaborate with internal teams and external suppliers to integrate materials, equipment, and process steps into manufacturing.

Work includes feasibility studies, equipment modifications, metrology, and cost-sensitive technology development for advanced logic and memory processes.

Experience Level

Mid-level - candidates typically have at least 6+ months of relevant R&D or industry experience; role targets early- to mid-career engineers with practical process development experience.

Responsibilities

Primary duties include process development, feasibility evaluation, and supplier collaboration.

• Develop and optimize manufacturing processes: materials, parameters, metrology, and system design.
• Conduct feasibility studies and pathfinding for new device architectures and process integration.
• Design and implement equipment modifications to improve throughput, efficiency, and yield.
• Collaborate with equipment and material suppliers to qualify and integrate enabling technologies.
• Perform experiments and simulations; analyze data and document results in technical reports and presentations.
• Monitor industry trends and contribute to technology roadmaps and cost-sensitive development plans.

Requirements

Minimum technical capabilities and workplace requirements; preferred skills listed separately.

Must-have:

• 6+ months relevant experience in semiconductor process development or related research.
• Fundamental knowledge of plasma physics, surface reactions, thin film processes, and semiconductor materials.
• Experience with experimental design, data collection, statistical analysis, and process result interpretation.
• Strong problem-solving skills and ability to work independently within cross-functional teams.
• Effective written and verbal technical communication skills.
• Willingness to work in fab or lab environments and follow safety and contamination-control protocols.

Nice-to-have:

• Research or hands-on experience related to plasma etch, pattern transfer, or advanced logic/memory process integration.
• Hands-on experience with dry etch tools (e.g., Lam, Applied Materials, TEL, ASM, Hitachi) on pilot or production lines.
• Knowledge of advanced-node etch challenges (high aspect ratio etching, CD control, etch selectivity, damage mitigation).
• Experience with Design of Experiments (DOE), statistical process control (SPC), process integration, or yield learning.
• Programming or scripting for data analysis or automation (Python, MATLAB, JMP, or similar).
• Familiarity with characterization techniques (SEM, TEM, AFM, XPS, ellipsometry) and semiconductor process flows.

Education Requirements

PhD in a STEM discipline such as Electrical Engineering, Materials Science, Applied Physics, Chemical Engineering, Chemistry, or a closely related field. The posting states requirements may be met through a combination of industry experience, internships, coursework, or research; a minimum of approximately 6+ months of relevant experience is expected.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.