Module Development Defect Inspection Engineer

Job Title

Module Development Defect Inspection Engineer

Role Summary

Join a process development team at Intel's Hillsboro, OR site to enable semiconductor module technologies for high-volume manufacturing and next-generation devices. The role focuses on process integration, defect inspection, equipment collaboration, and pathfinding to improve manufacturing yield and performance.

Experience Level

Mid-level. Typical background: 3+ years relevant industry experience for candidates with a Bachelor's degree; alternative combinations of graduate degrees and experience are possible (see Education Requirements).

Responsibilities

Lead and execute development tasks that enable module manufacturing and defect inspection capabilities.

• Drive process integration and equipment solutions for current and future technology nodes.
• Design and optimize manufacturing processes: material selection, parameter tuning, metrology, and system design.
• Perform pathfinding and feasibility studies using simulations and practical engineering methods.
• Recommend and implement equipment or process modifications to improve yield and throughput.
• Collaborate with suppliers and cross-functional partners (yield, operations, equipment/material vendors).
• Monitor industry trends and develop forward-looking process technology roadmaps.

Requirements

Must-have technical skills and domain experience; preferred items are listed separately.

• Must-have: 3+ years of hands-on experience in semiconductor processing, wafer-level assembly, or cleanroom environments (experience level varies by degree—see Education Requirements).
• Must-have: Practical experience with process development methodologies, statistical process control, and manufacturing process improvement.
• Must-have: Technical experience in module engineering or fab process/hardware technology development.
• Preferred: Metrology fundamentals and development experience.
• Preferred: Experience working with cross-functional teams including yield and operations.
• Preferred: Data analysis skills and familiarity with tools for process optimization and continuous improvement.
• Preferred: Packaging processes, equipment automation development, or project management experience.
• Strong communication, collaboration, analytical thinking, attention to detail, and adaptability.

Education Requirements

Required: Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or a related STEM discipline plus typically 3+ years relevant experience; OR Master's degree in these fields with ~2+ years experience; OR PhD in these fields (no experience required). Candidates may qualify via a combination of industry experience, internships, coursework, or research in related areas.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.