Role Summary
The Memory Design Engineer will work in the Memory IP group at GlobalFoundries in Bangalore. The successful candidate will design, simulate, and verify custom memory design blocks such as decoders and sense amplifiers.
Experience Level
Mid-level, with 6-20 years of work/industry experience required.
Responsibilities
Key responsibilities include:
- Developing CMOS memories such as SP SRAM, DP SRAM, Register File, and ROM.
- Circuit design, simulation, margining, and characterization of full custom circuits.
- Functional simulations and statistical analysis.
- Verifying bit cells and physical layout design.
- Sign off and release memory IPs on dedicated test chips.
- Support silicon bring-up and characterization.
- Participate in implementation & design/layout reviews.
- Contribute innovative ideas to address design problems.
- Collaborate with IP design and layout teams.
Requirements
Applicants must meet the following qualifications:
- Bachelor's or Master's degree in Electrical Engineering (VLSI, Microelectronics, or related fields).
- Proficient knowledge and experience with EDA tools for schematic design & simulations (Cadence, Mentor Graphics, Synopsys).
- Experience in SRAM memory designs and timing characterization.
- Desirable knowledge of Verilog and general analog mixed-signal design concepts.
- Strong communication skills and ability to work with cross-functional teams.
- Ability to collaborate on multiple concurrent projects.
Education Requirements
Bachelor's or Master's degree in Electrical Engineering (VLSI, Microelectronics, or related fields) from a reputed university.
About the Company
Company: GlobalFoundries
Headquarters: Saratoga Springs, New York, USA
GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.

Date Posted: 2026-03-16