Member of Technical Staff - Thin Films Engineer

Job Title

Member of Technical Staff - Thin Films Engineer

Role Summary

Senior thin‑films process engineer in Intel's Manufacturing Development and Customer Engineering (MDCE) organization responsible for developing, optimizing, and transferring thin film deposition processes (CVD, ALD, PVD, epitaxy, thermal/plasma, furnace, anneal, treatment) from development to high‑volume manufacturing across multiple technology nodes.

Work at the intersection of Technology Development and High‑Volume Manufacturing to meet foundry customer requirements and drive manufacturability, yield, throughput, and cost improvements.

Experience Level

Senior-level. The posting seeks experienced engineers; see Education Requirements for specific years-of-experience guidance tied to academic credentials.

Responsibilities

Lead technical and manufacturing efforts to improve thin film processes, resolve production issues, and partner across functions and with suppliers.

• Drive thin film process development and optimization for uniformity, defectivity, throughput, yield, and cost.
• Lead root-cause investigations and deliver technical solutions to meet aggressive technology node targets.
• Optimize equipment performance in partnership with internal teams and external suppliers.
• Design and execute experiments (DOE) and apply statistical process control (SPC) for process improvement.
• Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines.
• Collaborate with Technology Development, HVM, Integration, Device, Yield, Quality, Reliability, and supply chain teams.
• Present technical findings to engineering teams and executive leadership; contribute to technology roadmaps.
• Monitor industry trends and incorporate emerging process technologies into strategic initiatives.

Requirements

Must-have technical skills, manufacturing experience, and leadership capabilities for initial consideration. Preferred items listed at the end.

• Several years of semiconductor industry experience focused on thin film deposition and process development.
• Proven experience in manufacturing engineering, process development, and technical leadership in a production environment.
• Experience working with equipment suppliers (examples: AMAT, LAM, ASM, TEL) on process optimization.
• Hands-on proficiency with statistical process control (SPC), design of experiments (DOE), and factory automation systems.
• Fab startup experience across manufacturing, quality, R&D, and supply chain functions.
• Strong analytical skills for yield improvement, variation reduction, and performance enhancement.
• Excellent communication skills and ability to manage multiple high-priority projects and cross-functional initiatives.
• Nice-to-have: expertise in Gate-All-Around (GAA) logic technologies; published research or patent portfolio in thin film technologies; semiconductor foundry experience.

Education Requirements

Minimum: Master’s degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or a STEM-related field. Alternative: PhD with reduced industry experience requirement. The posting states these qualifications may be met via a combination of formal education, internships, research, and relevant industry experience. Preferred: doctoral degree with publications and patents in thin film technologies.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.