Member of Technical Staff, Product Integration Lead, HIG High Bandwidth Memory

Job Title

Product Integration Lead, HIG High Bandwidth Memory

Role Summary

Lead integration of Micron's High Bandwidth Memory (HBM) products into end-system requirements and drive alignment between silicon development and system needs. Serve as the primary owner for Success Criteria Documents (SCD) and coordinate cross-functional teams to meet system specifications, schedules, and risk constraints.

Experience Level

Senior - typically requires 10+ years of experience in product, design, yield enhancement, or related engineering fields.

Responsibilities

Key responsibilities include driving requirement alignment, managing technical risk, and coordinating cross-functional execution to deliver HBM solutions that meet system requirements.

• Manage technical inputs and drive silicon-to-system alignment on requirements and commitments using the Success Criteria Document (SCD).
• Collaborate with HBM Architecture, Product and Systems Engineering, Business Units, Technology Development, Packaging, and Global Quality to close gaps between HBM commitments and system requirements.
• Manage HBM sample delivery to align with system development timelines and assess associated risks.
• Lead triage teams for system or chip feature interactions to determine failure ownership and coordinate mitigations with stakeholders.
• Define and manage qualification criteria and lead the Change Control Board for late or post-qualification changes.
• Set and communicate priorities within the HBM development team to focus on system specifications and component/system concerns.
• Drive resolution of technical challenges within schedule, risk, and cost constraints.
• Apply AI tools and data-driven methods to streamline workflows and support technical decision making.

Requirements

Must-have technical skills, experience, and behaviors for successful performance.

• 10+ years of demonstrated experience in product development, design, yield enhancement, or related engineering roles.
• Proven ability to lead technical issues to closure with creative, collaborative solutions.
• Strong cross-functional collaboration skills and experience working with architecture, product, systems, technology development, packaging, and quality teams.
• Experience managing sample delivery, qualification activities, and change control processes.
• Excellent interpersonal, written, and presentation skills to gather technical input and drive issue mitigation.
• Familiarity with DRAM/HBM device design and system management is beneficial (nice-to-have).
• Experience with product development projects and system integration is a plus.

Education Requirements

Bachelor's or Master’s degree in Electrical Engineering or Computer Engineering.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.