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Member of Technical Staff - Integration Engineering

GlobalFoundries
May 09, 2026
Full-time
On-site
Essex Junction, Vermont, United States
$98,000 - $176,000 USD yearly
Process Engineering Jobs, Level - Senior

Job Title

Member of Technical Staff - Integration Engineering (BEOL Process Integration)

Role Summary

Responsible for managing the BEOL portion of an integrated CMOS process flow at GF Fab9 (200mm) in Essex Junction, VT. The role focuses on sustaining, improving, and transferring manufacturing technologies to improve reliability, yield, and manufacturability.

This is a daytime, Monday–Friday, fully onsite position reporting to Fab9 Process Integration management and working with cross-functional teams on process integration, qualification, and continuous improvement.

Experience Level

Senior-level. Requires multiple years of semiconductor process integration/manufacturing experience consistent with senior engineer responsibilities (see Education Requirements for specific year/degree combinations).

Responsibilities

Primary responsibilities include leading projects and small teams to maintain and improve BEOL process integration and production performance.

  • Identify, prioritize, and lead projects aligned with strategic goals.
  • Lead and coordinate teams (up to ~5 staff) to assess risk and execute tasks.
  • Monitor process signals, detect issues, and drive containment and corrective actions.
  • Improve manufacturing through defectivity reduction, process stability (Cp/Cpk), process control, and optimized process sequences.
  • Drive yield and cost improvements via material, sequence, and platform optimization.
  • Transfer technologies into and out of the fabricator and support module development activities.
  • Collaborate with technology development and process teams to integrate best practices into new technologies.
  • Develop and improve test structures for characterization and qualification.
  • Perform project management, data analysis, and cross-functional problem resolution.
  • Support Environmental, Health, Safety & Security requirements and other duties as assigned.

Requirements

Must-have technical skills and experience required on day one (education items moved to Education Requirements below).

  • Prior process integration experience in semiconductor manufacturing, including FEOL and/or MOL/BEOL process experience.
  • Demonstrated project management and team leadership experience; ability to drive projects and influence cross-functional teams.
  • Experience applying Statistical Process Control (SPC) and Design of Experiments (DOE).
  • Strong structured problem-solving skills and data-driven decision making.
  • Effective verbal and written communication and ability to work with diverse teams.
  • Willingness to travel up to 10%.

Nice-to-have / preferred:

  • Broad understanding of device integration (Al & Cu interconnects, passive device structures, MIM capacitor integration) and device physics.
  • Experience analyzing PCM and physical data to identify and demonstrate process improvements.
  • Familiarity with Lean Manufacturing principles.

Education Requirements

Required combinations stated by the employer: Bachelor of Science in Math, Mechanical Engineering, Electrical Engineering, Physics, or a related discipline plus ~6–7 years semiconductor engineering/manufacturing experience; OR Master’s degree plus ~5–6 years semiconductor engineering/manufacturing experience; OR PhD plus ~3–4 years semiconductor engineering/manufacturing experience. Preferred: Master’s degree in science, math, engineering, semiconductor manufacturing, or a related discipline.


About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.

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Date Posted: 2026-05-09