Mechanical Design Engineer - Semiconductor Packaging

Job Title

Mechanical Design Engineer - Semiconductor Packaging

Role Summary

This role designs mechanical components, tooling, and packaging collateral for semiconductor package assemblies and assembly processes. The engineer will produce detailed designs and drawings, ensure manufacturability, and act as the single point of contact for mechanical packaging collateral.

The position requires cross-functional collaboration with architecture, process, and assembly teams and is based on-site in Phoenix, AZ.

Experience Level

Mid-level. Typically requires 1+ years of relevant experience with mechanical CAD and design; posted as an Experienced Hire.

Responsibilities

Primary responsibilities include:

• Design tape-and-reel packaging for die shipments from fab to assembly.
• Create and maintain mechanical designs and detailed drawings for substrates, integrated heat spreaders (IHS), stiffeners, and overall package assemblies.
• Design process media trays used during stages of the assembly process.
• Collaborate with architecture, process, and assembly teams to ensure design intent and manufacturability.
• Serve as the single point of contact for packaging mechanical design collateral.
• Proactively identify and resolve design and process issues to meet project timelines.

Requirements

Must-have:

• US Citizenship and ability to obtain and maintain a US Government TS/SCI security clearance with polygraph.
• 1+ years' experience using 2D/3D CAD tools such as SolidWorks, Siemens NX, AutoCAD, or similar.
• Experience producing and interpreting technical drawings and specifications.
• Strong communication, interpersonal, time management, and cross-functional collaboration skills.
• Ability to work on-site in Phoenix, AZ and perform with minimal supervision.

Preferred:

• Solid mechanical design foundation and strong 3D spatial awareness.
• Experience supporting semiconductor packaging, assembly, or tooling design.
• Project management experience and proactive problem-solving skills.

Education Requirements

Bachelor's degree in Mechanical Engineering or a related STEM field is required. A Master's degree in Mechanical Engineering or a related STEM field is preferred. The posting indicates relevant experience, internships, or research may be considered as equivalent to formal education where applicable.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.