Mechanical Design Engineer - Semiconductor Packaging
Intel CorporationJob Title
Mechanical Design Engineer - Semiconductor Packaging
Role Summary
Design mechanical components, packaging, and tooling for semiconductor assembly and packaging processes. Serve as the single point of contact for mechanical design collateral and work cross-functionally with architecture, process, and assembly teams to ensure manufacturability and timely execution.
Experience Level
Entry-level / Early career. Role expects approximately 1+ years of relevant experience.
Responsibilities
Primary responsibilities include detailed mechanical design, documentation, and cross-team coordination to enable packaging and assembly.
- Design Tape and Reel packaging for die shipments from fab to assembly.
- Develop and maintain mechanical designs and detailed drawings for substrates, integrated heat spreaders (IHS), stiffeners, and complete package assemblies.
- Design process media trays used during assembly stages.
- Collaborate with architecture, process, and assembly teams to validate design intent and manufacturability.
- Act as the single point of contact for packaging mechanical design collateral.
- Identify and resolve design and process issues to meet project schedules.
Requirements
Must-have technical qualifications and security eligibility; preferred items noted.
- Must: US Citizenship required.
- Must: Ability to obtain and maintain a US Government TS/SCI security clearance with polygraph.
- Must: Minimum 1 year experience with CAD tools such as SolidWorks, Siemens NX, AutoCAD, or similar 2D/3D CAD software.
- Must: Strong mechanical design fundamentals and 3D spatial awareness; ability to interpret and produce technical drawings and specifications.
- Must: Effective written and verbal communication for cross-functional collaboration and project management.
- Nice-to-have: Master's degree in mechanical engineering or a STEM field; prior semiconductor packaging or assembly experience.
Education Requirements
Bachelor's degree in mechanical engineering or a STEM-related field is required. A Master’s degree in mechanical engineering or a related STEM field is preferred. Relevant combinations of education, internship, research, or equivalent practical experience may be considered.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
