Manager, Semiconductor IC Packaging & Assembly Engineering

Job Title

Manager, Semiconductor IC Packaging & Assembly Engineering

Role Summary

Manage sustaining and manufacturing engineering for semiconductor IC packaging and assembly, focusing on yield, process stability, quality, and NPI-to-HVM transfers for power and advanced packaging technologies.

Work cross-functionally with Package Engineering, Product Engineering, Quality, Supply Chain, and OSAT partners to enable reliable high-volume manufacturing.

Experience Level

Senior; typically requires 8+ years in semiconductor manufacturing and packaging engineering and 1+ year leading technical projects or mentoring engineers.

Responsibilities

Primary responsibilities include manufacturing execution, yield improvement, quality support, and coordinating new-product ramps with internal and external partners.

• Support sustaining engineering across package assembly technologies and assigned product lines.
• Drive improvements in yield, cycle time, throughput, quality, and cost.
• Perform data-driven yield monitoring, SPC/DOE analysis, and root-cause investigations.
• Manage process changes, qualification plans, and manufacturing readiness documentation.
• Coordinate NPI-to-HVM transfers and structured ramp execution with OSAT and supply-chain partners.
• Maintain KPIs and dashboards to track manufacturing performance and corrective actions.
• Support containment, corrective/preventive actions, audits, and supplier qualification activities.
• Provide technical guidance to engineering teams and improve engineering processes and practices.

Requirements

Must-have technical skills and experience (concise):

• 8+ years in semiconductor manufacturing/packaging engineering with IC assembly and NPI-to-HVM transfer experience.
• 1+ year leading technical projects or coordinating engineering activities.
• Practical knowledge of assembly processes: wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, and SMT.
• Experience with power packaging and power device packages; exposure to SiC/GaN and advanced interconnects is valuable.
• Familiarity with substrates and interconnects such as DBC and AMB is a plus.
• Strong skills in yield analysis, SPC, DOE, reliability testing, process control, and statistical analysis tools.
• Experience working with global OSAT partners, supplier qualification, and contract manufacturing coordination.
• Knowledge of quality systems, change control, and manufacturing qualification methodologies.
• Strong analytical, organizational, communication, and cross-functional collaboration skills.

Education Requirements

Bachelor's degree required in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related technical discipline. Master’s degree or PhD in engineering or a related field is preferred.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.