Manager, Field Applications Engineering (USA)

Job Title

Manager, Field Applications Engineering (USA)

Role Summary

Lead and grow a distributed Field Applications Engineering (FAE) team across the United States to drive technical adoption, integrations, and the design-win pipeline for next-generation fabric interconnect silicon IP. This is a hands-on senior management role covering both pre-sales and post-sales technical support and escalation.

Primary location Santa Clara, CA with an option for Austin, TX. Travel up to 30%.

Experience Level

Senior-level. Management: 5+ years leading customer-facing engineering teams. Industry: 10+ years in semiconductor, silicon IP, or high-performance networking preferred.

Responsibilities

The role combines people management, technical account leadership, and product-ecosystem enablement.

• Lead and expand a distributed team of senior FAEs across the USA: recruit, onboard, and mentor engineers; set regional goals aligned with corporate objectives.
• Partner with regional sales directors to develop strategy and secure high-value design wins.
• Provide escalation point for critical customer technical issues and own delivery of solutions.
• Oversee customer evaluations, proofs-of-concept, and architectural reviews.
• Deliver technical presentations, deep dives, and product demonstrations to engineering teams and executives.
• Collect and funnel customer requirements and market insights to R&D and product management to influence roadmap.
• Create enablement collateral: application notes, whitepapers, training materials to accelerate customer adoption.
• Travel as required to support customers and regional teams (up to ~30%).

Requirements

Must-have technical, leadership, and industry qualifications. Preferred items are noted separately.

• 5+ years managing customer-facing engineering teams (FAE or technical support).
• 10+ years experience in the semiconductor, silicon IP, or high-performance networking sectors.
• Deep experience with Network-on-Chip (NoC) and interconnect protocols (AMBA CHI/AXI/ACE, PCIe/CXL).
• Familiarity with front-end ASIC design flow, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens).
• Understanding of AI/ML accelerators, data center architectures, and automotive SoC requirements.
• Strong English verbal and written communication skills and experience managing cross-cultural teams and clients.
• Self-motivated, able to work in a fast-paced, early-stage startup environment.

Preferred (nice-to-have):

• Prior experience at a fast-growing, venture-backed silicon IP startup.
• Existing technical relationships with major Tier-1 semiconductor and system companies in the USA.

Education Requirements

Required: Bachelor's degree in Electrical Engineering, Computer Engineering, or a related STEM field. Preferred: Master’s degree or PhD in Electrical or Computer Engineering.

About the Company

Company: Baya Systems

Headquarters: Santa Clara, CA, USA

Baya Systems is a fast-moving Series B startup focused on accelerating intelligent computing in the emerging chiplet era. They design and license disruptive intellectual property for semiconductor chips and provide software-driven solutions for single-die and multi-die systems. Their contributions aim to simplify the design process for complex System-on-Chip (SoC) and multi-chiplet systems across various markets such as data center, AI, and automotive.