Low Yield Analysis Engineer on Shift

Job Title

Low Yield Analysis Engineer on Shift

Role Summary

This lab-based, on-site engineering role in the APTD LYA Foundry Labs Network performs design, test, checkout, modification, and electrical characterization of wafer-level assembly and packaging technologies to identify root causes of yield loss and in-line failures.

The engineer works on a shift schedule, bridging technicians, shift-1 engineers, module partners, yield support, integration teams and external suppliers to deliver failure analysis, characterization, and corrective actions.

Experience Level

Entry-level / Early Career. The posting lists a minimum of approximately 2 years of relevant experience.

Responsibilities

Primary responsibilities include hands-on lab work, analysis, and cross-team coordination.

• Plan and execute lab tests for wafer-level assembly technologies; perform device checkout, modifications, and characterization.
• Analyze in-line electrical failures and provide root-cause determination and corrective recommendations.
• Define data-acquisition strategies and perform data analysis to support failure investigations.
• Develop and document failure-analysis techniques, best-known-methods (BKMs), and process characterization approaches.
• Coordinate across internal teams and external suppliers to meet program milestones and deliverables.
• Provide technical consultation on packaging/assembly issues and respond to customer requests or events.
• Support project management, package design/development, and sustaining activities for assemblies and electronic components.

Requirements

Must-have skills and attributes for initial consideration (degrees summarized under Education Requirements).

• Hands-on lab experience and ability to perform shift work in an on-site environment.
• Strong analytical and problem-solving skills; ability to work with ambiguity and changing priorities.
• Experience with electrical characterization, fault isolation, and data-driven troubleshooting.
• Effective verbal and written communication and presentation skills for technical audiences.
• Ability to work cross-functionally with engineers, technicians, and external partners.

Nice-to-have:

• Experience with destructive and optical analysis: cross-sectioning, delayering, SEM, x-ray, microscopy, CSAM, ion milling, TEM, FIB.
• Familiarity with electrical fault isolation tools and techniques (hand probe, curve tracer, auto probing, TDR, EOTPR, EBAC, RIDR, ELITE).
• Chemical/compositional analysis experience: EDX, AFM, FTIR, Raman, XRD, EBSD.
• Knowledge of package/die mapping software (e.g., Mentor Graphics, SysNav/CadNav, FIELD), SQL scripting, and basic statistical tools such as JMP.

Education Requirements

Must possess a Bachelor's Degree with at least 2 years of experience, or a Master's Degree, in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.