Low-Temperature Bonding Engineer

Job Title

Low-Temperature Bonding Engineer

Role Summary

R&D assembly engineer on the Quantum Advanced Packaging team supporting Fab9. The role develops and qualifies low-temperature bonding and advanced die-assembly processes for superconducting and cryogenic quantum packaging platforms.

Primary responsibilities include process development, tool optimization, defect reduction, and integration with test and systems teams to meet cryogenic reliability and electrical/RF requirements.

Experience Level

Mid-level. The posting specifies approximately 4 years of prior related work experience.

Responsibilities

The engineer will develop and qualify assembly processes and work across teams to integrate those processes into production-worthy modules.

• Develop and optimize low-temperature bonding processes (e.g., superconducting metal bonding, thermo-compression, hybrid bonding) for quantum packaging.
• Characterize bond quality, electrical performance, mechanical integrity, and reliability under cryogenic conditions.
• Define process windows and critical-to-quality parameters; own process modules from development through qualification.
• Plan and execute experiments and DOE activities to improve capability and robustness.
• Collaborate with test and systems teams to ensure cryogenic reliability and electrical/RF integrity of assembled hardware.
• Work with equipment teams to define requirements for high-precision alignment, bonding tools, and cryogenic-compatible materials handling.
• Analyze data, prepare technical reports, and provide clear updates to stakeholders.
• Contribute to roadmap and capability build-out for the Advanced Packaging and Photonics Center (APPC).
• Support IP generation, publications, and conference contributions.
• Perform work following safety, environmental, health, and security requirements; participate in hiring and mentoring team members.

Requirements

Must-have technical skills, experience, and other requirements (education details are listed separately under Education Requirements).

• At least 4 years of prior related work experience in assembly, packaging, or process development.
• In-depth knowledge of BEOL processes and integration, bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
• Strong problem-solving and technical troubleshooting skills, including experience with design of experiments (DOE).
• Experience characterizing mechanical, electrical, and reliability performance, especially under cryogenic conditions.
• Ability to define equipment requirements and evaluate tool capability versus packaging needs.
• English fluency (written and verbal) and ability to present technical data clearly.
• Willingness to travel up to 10%.

Preferred (nice-to-have)

• Leadership experience and project management skills; ability to navigate ambiguity and execute solutions.
• Strong written and verbal communication, planning, and organizational skills.

Education Requirements

Bachelor's degree (BS) required in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field from an accredited program; the posting specifies a BS with at least 4 years of related work experience and a minimum overall GPA of 3.0. A Master's degree (MS) is preferred (MS with ~2 years related experience noted). No explicit substitute-by-equivalent-experience language is provided in the source.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.