Leader of Analog, Mixed-Signal & RF IC Design

Job Title

Leader of Analog, Mixed-Signal & RF IC Design

Role Summary

Lead and grow the Analog, Mixed-Signal & RF IC design organization responsible for IPs for data center SERDES applications (including DSPs, drivers, and TIAs) targeting 200G and 400G. This is a people-management role with significant hands-on technical leadership and responsibility for architecture, tape-out, and productization.

Report to senior management, collaborate cross-functionally (system engineering, digital, CAD, technology, support teams), and represent the design organization to customers and executives.

Experience Level

Senior-level (Director / Senior Manager). Requires substantial leadership and IC design experience — typically a decade or more of relevant industry experience in analog/mixed-signal or RF IC design and team management.

Responsibilities

The role combines hands-on technical direction with people leadership and program accountability. Key responsibilities include:

• Provide technical leadership, set roadmaps, and drive architectural decisions for mixed-signal designs across global teams.
• Partner with IC designers and system engineers to develop high-performance analog/mixed-signal and RF circuits.
• Translate product specifications into block-level design requirements and ensure technical excellence in implementation.
• Build, mentor, and develop a world-class team of analog, mixed-signal, and RF IC designers; recruit and retain top talent.
• Manage performance, career development, and succession planning; coach to enhance organizational capability.
• Collaborate with system engineering, digital design, CAD, technology, and support teams to optimize design flows and productivity.
• Interface with customers during development and release-to-production phases and represent the design organization in executive discussions.
• Oversee IC tape-out, productization, manufacturability, quality, and time-to-market objectives.
• Champion continuous improvement in design processes and methodologies.

Requirements

Must-have technical and leadership qualifications (minimum expectations):

• Extensive hands-on experience in analog, mixed-signal, or RF IC design with a proven track record of IC tape-out and productization.
• Deep knowledge of analog, mixed-signal, and RF IC design principles and practices.
• Hands-on experience with advanced CMOS process nodes.
• Proven success managing and developing engineering teams and leading cross-functional programs.
• Strong written and verbal communication, customer-facing experience, and executive presentation skills.
• Demonstrated ability to drive strategic initiatives, make decisions, and deliver results on schedule.
• Collaborative mindset with the ability to influence across organizational boundaries.

Nice-to-have:

• Experience with data center SERDES (200G/400G), DSPs, high-speed drivers, and TIAs.
• Experience optimizing design flows and CAD/methodology for mixed-signal teams.

Education Requirements

BS in Electrical Engineering or related field plus 11 years of experience, or MS plus 9 years, or Ph.D. plus 6 years (degree plus experience equivalencies specified). Fields cited include Electrical Engineering or related technical disciplines; employer also considers role-related criteria and equivalent experience in assessing compensation and fit.

About the Company

Company: MaxLinear

Headquarters: Carlsbad, CA, United States

Fabless semiconductor company that designs RF, analog, digital, and mixed-signal system-on-chip solutions for access and connectivity, data center and optical interconnects, wired/wireless infrastructure, and industrial and multi-market applications.