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Lead Physical Design Engineer

NXP Semiconductors
August 27, 2026
Full-time
On-site
Pune, Maharashtra, India
Physical Design Jobs, Level - Senior

Job Title

Lead Physical Design Engineer

Role Summary

Responsible for implementation and signoff of complex SoC/IP physical designs in advanced technology nodes within the VLSI team. Deliver block- and chip-level physical design meeting power, performance, area (PPA) and reliability targets.

Collaborate with RTL, STA, DFT, packaging and integration teams and contribute to methodology and automation improvements.

Experience Level

Senior-level. Target experience: 8–10 years in ASIC physical design.

Responsibilities

Deliver block- and full-chip physical design from synthesized netlist to GDSII and ensure design closure to signoff.

  • Floorplanning and power grid design; placement and optimization.
  • Clock Tree Synthesis (CTS) and timing optimization.
  • Routing, post-route optimization and congestion mitigation.
  • Drive timing convergence across MCMM scenarios in collaboration with STA teams.
  • Ensure setup/hold timing closure, DRC/LVS clean signoff, and IR drop / electromigration (EM) compliance.
  • Debug and resolve congestion, SI/crosstalk issues, and functional/physical ECOs.
  • Collaborate with RTL/design, DFT, packaging and full-chip integration teams for QoR and test readiness.
  • Develop and apply scripts and automation to improve methodology and productivity.
  • Follow and enforce NXP design methodologies, quality and reliability standards.

Requirements

Core qualifications and skills required for the role.

  • 8–10 years of experience in ASIC physical design, including implementation and signoff of SoC/IP blocks.
  • Strong fundamentals in physical design implementation and signoff for advanced technology nodes.
  • Proven ability to meet PPA and reliability targets and to work across MCMM/STA for timing closure.
  • Ability to debug congestion, SI/crosstalk, IR drop/EM and perform functional/physical ECOs.
  • Experience collaborating with RTL, DFT, packaging and full-chip integration teams.
  • Experience developing automation and scripting to improve methodology and delivery.

Nice-to-have: experience with full-chip integrations and advanced-node signoff flows.

Education Requirements

Bachelor's or Master's degree in Electronics, Electrical Engineering, or Microelectronics.


About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.

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Date Posted: 2026-08-27